| Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance | |
| Hao-Ren Wen; Ya-Qiang Ji; Matthew M.F. Yuen; Xian-Zhu Fu; Rong Song; Ching-Ping Wong | |
| 2016 | |
| 会议名称 | The 17th International Conference on electronic packing Technology (ICEPT 2016) |
| 会议地点 | Changsha,China |
| 英文摘要 | Abstract- Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between AI blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance. |
| 收录类别 | EI |
| 语种 | 英语 |
| 内容类型 | 会议论文 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/10116]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2016 |
| 推荐引用方式 GB/T 7714 | Hao-Ren Wen,Ya-Qiang Ji,Matthew M.F. Yuen,et al. Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance[C]. 见:The 17th International Conference on electronic packing Technology (ICEPT 2016). Changsha,China. |
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