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A novel graphene oxide millisphere / epoxy resin composite with Enhanced Thermal Conductivit 会议论文
上海, 2018
作者:  Chen Li;  Xiaoliang Zeng;  Deliang Zhu;  Rong Sun;  Jianbin Xu
收藏  |  浏览/下载:28/0  |  提交时间:2019/01/31
High thermal conductive epoxy resin composites filled with Al2O3@BN core-shell hybrid particles 会议论文
上海, 2018
作者:  Huayuan Li;  Yuan Gao;  Pengli Zhu;  Gang Li;  Rong Sun
收藏  |  浏览/下载:25/0  |  提交时间:2019/01/31
Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文
Harbin
作者:  Gang Li;  yachuan He;  Pengli Zhu;  Tao Zhao;  Rong Sun
收藏  |  浏览/下载:38/0  |  提交时间:2018/02/02
Enhanced Thermal Conductivity and Mechanical Properties of Epoxy Resin-Alumina-Silicon Carbide Fibers Three-Phase Composites 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Xiaoliang Zeng;  Kun Guo;  Shuhui Yu;  Rong Sun;  Jian-Bin Xu
收藏  |  浏览/下载:17/0  |  提交时间:2017/01/15
Development and Application of Polymer-based Nanocomposite Dielectrics 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Suibin Luo;  Shuhui Yu;  Rong Sun;  Ching-Ping Wong
收藏  |  浏览/下载:19/0  |  提交时间:2017/01/15
Enhanced dielectric property and energy density of polydopamine encapsuled BaTiO3 nanofibers/PVDF nanocomposites 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Hongchang Liu;  Suibin Luo;  Shuhui Yu;  Shanjun Ding;  Rong Sun
收藏  |  浏览/下载:20/0  |  提交时间:2017/01/15
Mesoporous Silica Nanoparticles: A Potential Inorganic Filler To Prepare Polymer Composites With Low CTE And Low Modulus For Electronic Packaging Applications 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Gang;  Zhu, Pengli;  Zhao, Tao;  Sun, Rong;  Lu, Daoqiang
收藏  |  浏览/下载:24/0  |  提交时间:2017/01/15
One-pot synthesis of silica nanospheres with bimodal size distribution for application in underfill composite 会议论文
The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China
作者:  Qian Guo;  Gang Li;  Pengli Zhu;  Rong Sun;  Daoqiang (Daniel) Lu
收藏  |  浏览/下载:20/0  |  提交时间:2016/01/27
Investigating the rheological and thermomechanical properties of SiO2/epoxy nanocomposites: probing the role of silane coupling agent 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:  Li, Gang;  Zhu, Pengli;  Huang, Liang;  Zhao, Tao;  Sun, Rong
收藏  |  浏览/下载:13/0  |  提交时间:2015/09/01
High dielectric performance of polymer composites based on BaTiO3-supporting Ag hybrid fillers 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:  Fang, Fang;  Luo, Suibin;  Yu, Shuhui;  Sun, Rong
收藏  |  浏览/下载:12/0  |  提交时间:2015/09/01


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