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	Enhanced Thermal Conductivity and Mechanical Properties of Epoxy Resin-Alumina-Silicon Carbide Fibers Three-Phase Composites
	Xiaoliang Zeng; Kun Guo; Shuhui Yu; Rong Sun; Jian-Bin Xu
	2016
会议名称	The 17th International Conference on electronic packing Technology (ICEPT 2016)
会议地点	Changsha,China
英文摘要	Epoxy resin composites with high thermal conductivity have received a great deal of attention both in science and engineering. However, improving thermal conductivity usually relies on introduction of thermally conductive inorganic particles, which will inevitably decrease their mechanical strength. Here, we report a three-phase composite material with epoxy resin as matrix and both alumina (Al2O3) particles and silicon carbide fibers (SiCf) as fillers. The composites exhibited high and anisotropically thermal conductivity that the in-plane and through-plane values reached 1.55 and 0.50 W/ (m K), respectively. Furthermore, the addition of SiCf led to improved mechanical properties and excellent thermal stability. This approach will guide the design of high-performance polymer composites with high thermal conductivity and meanwhile excellent mechanical properties.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/10107]
专题	深圳先进技术研究院_集成所
作者单位	2016
推荐引用方式 GB/T 7714	Xiaoliang Zeng,Kun Guo,Shuhui Yu,et al. Enhanced Thermal Conductivity and Mechanical Properties of Epoxy Resin-Alumina-Silicon Carbide Fibers Three-Phase Composites[C]. 见:The 17th International Conference on electronic packing Technology (ICEPT 2016). Changsha,China.

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