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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 学科主题：Engineering, Electrical & Electronic     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379 作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR 收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05 Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth   Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy 期刊论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1333-1336 作者:  Wei, S;  Zhou, LJ;  Guo, JD 收藏  |  浏览/下载：25/0  |  提交时间：2018/12/25 thermal interface materials  low-melting-temperature alloy  Ti-coated diamond particles   Study on the composite coating process of oxide particles in magnetic thin films 期刊论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1250-1253 作者:  Li, B;  Liu, GM;  Liu, ZQ 收藏  |  浏览/下载：14/0  |  提交时间：2018/12/25 Core material  composite coating  resistivity  magnetic properties   Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文 IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187 作者:  Zhang, Hui;  Li, Jianfeng;  Dai, Jingru;  Corfield, Martin;  Liu, Xuejian 收藏  |  浏览/下载：32/0  |  提交时间：2018/12/28 Electronic packaging  finite-element (FE) method  material reliability  planar power module  power cycling  X-ray computation tomography   Lifetime of solder joint and delamination in flip chip assemblies 期刊论文 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186 Cheng, ZN 收藏  |  浏览/下载：29/0  |  提交时间：2012/03/24 UNDERFILL MATERIAL PROPERTIES  FATIGUE  RELIABILITY  RELAXATION  STRESS  MODEL  INTERFACES  PACKAGE  GLASS