Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy

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	Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy
	Wei, S ; Zhou, LJ ; Guo, JD
刊名	2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
	2018-01-06
页码	1333-1336
关键词	thermal interface materials low-melting-temperature alloy Ti-coated diamond particles
英文摘要	A thermal interface material (TIM) with high thermal conductivity and excellent flexibility is present using a special process. In our method, the lowmelting-temperature alloy (LMTA) is used to produce metallurgical bonding between heat-conducting particles. Then the foaming agent is brought in material preparation to build a uniform inter-connective porous structure throughout the composite, and afterwards, organic silicone resin will completely fill the matrix above in a vacuum. After curing, the silicone resin can offer necessary restriction for leak problem of LMTA, meanwhile, the composite material can also absorb shock and provide optimum bonding with contact surfaces.
学科主题	Engineering, Electrical & Electronic
语种	英语
WOS记录号	WOS:000450155700294
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/80224]
专题	金属研究所_中国科学院金属研究所
作者单位	1.[Wei, Song 2.Zhou, Li-Jun 3.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 4.[Wei, Song 5.Zhou, Li-Jun 6.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China
推荐引用方式 GB/T 7714	Wei, S,Zhou, LJ,Guo, JD. Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy[J]. 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2018:1333-1336.
APA	Wei, S,Zhou, LJ,&Guo, JD.(2018).Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy.2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),1333-1336.
MLA	Wei, S,et al."Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy".2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) (2018):1333-1336.