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浏览/检索结果: 共14条，第1-10条 帮助 限定条件 学科主题：Engineering, Electrical & Electronic    专题：金属研究所    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Understanding Interlayer Coupling in TMD-hBN Heterostructure by Raman Spectroscopy 期刊论文 IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 卷号: 65, 期号: 10, 页码: 4059-4067 作者:  Ding, L;  Ukhtary, MS;  Chubarov, M;  Choudhury, TH;  Zhang, F 收藏  |  浏览/下载：27/0  |  提交时间：2018/12/25 2-D material  interference effect  low-frequency (LF) vibration  Raman enhancement   The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781 作者:  Du, YH;  Liu, ZQ;  Ji, HJ;  Li, MY;  Wen, M 收藏  |  浏览/下载：14/0  |  提交时间：2018/12/25 Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379 作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR 收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05 Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth   Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033 作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD 收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05 Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion   Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy 期刊论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1333-1336 作者:  Wei, S;  Zhou, LJ;  Guo, JD 收藏  |  浏览/下载：25/0  |  提交时间：2018/12/25 thermal interface materials  low-melting-temperature alloy  Ti-coated diamond particles   Study on the composite coating process of oxide particles in magnetic thin films 期刊论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1250-1253 作者:  Li, B;  Liu, GM;  Liu, ZQ 收藏  |  浏览/下载：14/0  |  提交时间：2018/12/25 Core material  composite coating  resistivity  magnetic properties   Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor 期刊论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1241-1245 作者:  Yang, LL;  Gao, LY;  Chen, CH;  Liu, ZQ 收藏  |  浏览/下载：12/0  |  提交时间：2018/12/25 micro-inductor  NiFe thin film  in-plane anisotropy  magnetic electroplating   Preparation of poly(vinyl alcohol)-based separator with pore-forming additive for lithium-ion batteries 期刊论文 SPRINGER, 2017, 卷号: 28, 期号: 23, 页码: 17516-17525 作者:  Xiao, Wei;  Zhang, Kaiyue;  Liu, Jianguo;  Yan, Chuanwei;  Xiao, W (reprint author), Chinese Acad Sci, Inst Met Res, Lab Corros & Protect, Shenyang 110016, Liaoning, Peoples R China. 收藏  |  浏览/下载：12/0  |  提交时间：2018/01/10 Magnetotransport in Ultrathin 2-D Superconducting Mo2C Crystals 期刊论文 IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 2017, 卷号: 53, 期号: 11, 页码: - 作者:  Song, Shuang;  Wang, Libin;  Xu, Chuan;  Cheng, Hui-Ming;  Ren, Wencai 收藏  |  浏览/下载：24/0  |  提交时间：2018/01/10 2-d Superconductivity  Chemical Vapor Deposition (Cvd)  Transition Metal Carbides (Tmcs)  Magnetotransport   Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348 Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu 收藏  |  浏览/下载：34/0  |  提交时间：2017/08/17 Fe-Ni under bump metallization (UBM)  thermal cycling  microstructural evolution  lifetime  recrystallization  electron backscatter diffraction (EBSD)