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Band Engineering SnTe via Trivalent Substitutions for Enhanced Thermoelectric Performance 期刊论文
CHEMISTRY OF MATERIALS, 2021
作者:  Zhang, Xuemei;  Wang, Zhongyi;  Zou, Bo;  Brod, Madison K.;  Zhu, Jianbo
收藏  |  浏览/下载：22/0  |  提交时间：2022/01/10
SN38-based albumin-binding prodrug for efficient targeted cancer chemotherapy 期刊论文
JOURNAL OF CONTROLLED RELEASE, 2021, 卷号: 339, 页码: 297-306
作者:  Huang, Ying;  Wang, Lei;  Cheng, Zhiyang;  Yang, Biyu;  Yu, Jiahui
收藏  |  浏览/下载：24/0  |  提交时间：2021/12/01
Prodrug nanoparticles rationally integrating stroma modification and chemotherapy to treat metastatic pancreatic cancer 期刊论文
BIOMATERIALS, 2021, 卷号: 278
作者:  Wang, Liying;  Liu, Zimo;  Zhou, Quan;  Gu, Sufang;  Liu, Xiangsheng
收藏  |  浏览/下载：39/0  |  提交时间：2021/11/29
Hot subdwarfs from the surviving companions of the white dwarf plus main-sequence channel of Type Ia supernovae 期刊论文
MONTHLY NOTICES OF THE ROYAL ASTRONOMICAL SOCIETY, 2021, 卷号: 507, 期号: 3, 页码: 4603-4617
作者:  Meng XC(孟祥存);  Luo, Yang-Ping
收藏  |  浏览/下载：54/0  |  提交时间：2021/11/01
Enhanced Antiwear Property of Cu-Sn-Bi Bimetal Composites with TiB2 under Different Working Conditions 期刊论文
TRIBOLOGY TRANSACTIONS, 2021, 卷号: 65, 期号: 1, 页码: 78-87
作者:  Yang, Dongya;  Li, Zhenyu;  Zhao, Gengrui;  Wang, Honggang;  Ren, Junfang
收藏  |  浏览/下载：32/0  |  提交时间：2021/12/17
A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder 期刊论文
MATERIALS LETTERS, 2021, 卷号: 297, 页码: 4
作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  An, Xizhong
收藏  |  浏览/下载：59/0  |  提交时间：2021/10/15
Zeolite Socony Mobil-Five Coating on Ti-24 Nb-4 Zr-7.9 Sn Promotes Biocompatibility and Osteogenesis In Vitro and In Vivo 期刊论文
BIOMED RESEARCH INTERNATIONAL, 2021, 卷号: 2021, 页码: 7
作者:  Hang, Xiaodong;  Liu, Xiaohan;  Hu, Ying;  Jiao, Yilai;  Wu, Lin
收藏  |  浏览/下载：29/0  |  提交时间：2021/10/15
Symmetry energy extracted from the S pi RIT pion data in Sn plus Sn systems 期刊论文
PHYSICAL REVIEW C, 2021, 卷号: 104, 期号: 1, 页码: 6
作者:  Yong, Gao-Chan
收藏  |  浏览/下载：17/0  |  提交时间：2021/12/09
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：18/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：12/0  |  提交时间：2022/02/17

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