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期刊论文 [28]
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Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites
期刊论文
COMPOSITES COMMUNICATIONS, 2020, 卷号: 22
作者:
He, Jing
;
Wang, Hua
;
Qu, Qiqi
;
Su, Zheng
;
Qin, Tengfei
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2021/03/15
GO-SiC structure
Epoxy resin
Thermal conductivity
Reliability
The oxidation effect on the cracking behavior of a Co-based alloy under thermal shocks
期刊论文
Corrosion Science, 2020, 卷号: 173
作者:
Wen, Junxia
;
Cao, Rui
;
Che, Hongyan
;
Dong, Hao
;
Zhang, Haiyan
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  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Cracks
Electronics packaging
Oxidation
Thermal expansion
Thermal shock
Co-based alloys
Coefficients of thermal expansions
Cracking behavior
Oxidation behaviors
Oxidation effects
Sample surface
Static conditions
Volume change
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration
期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:
Gao Liyin
;
Li Caifu
;
Cao Lihua
;
Liu Zhiquan
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2021/02/03
Effect of AlN addition on phase formation in the LTCC with Al2O3/AlN biphasic ceramics based on BBSZ glass
期刊论文
CERAMICS INTERNATIONAL, 2020, 卷号: 46
作者:
Feng, Xiangyan
;
Lv, Yuanyuan
;
Zhang, Lan
;
Ge, Daowen
;
Li, Xiaoxiao
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  |  
浏览/下载:59/0
  |  
提交时间:2020/11/26
Thermal conductivity
Dielectric properties
Nanoneedle crystal
LTCC
AlN
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者:
Bi, Xiaoyang
;
Hu, Xiaowu
;
Li, Qinglin
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  |  
浏览/下载:16/0
  |  
提交时间:2022/03/01
Solder joints
Ni-Co film
Shear strength
Atomic model
Intermetallic compound
First-principles calculations
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
作者:
Wang, Changchang
;
Chen, Yinbo
;
Liu, Zhi-Quan
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  |  
浏览/下载:7/0
  |  
提交时间:2021/02/02
Cu-Sn IMC
Growth behavior
External stress effect
Isothermal aging
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
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  |  
浏览/下载:16/0
  |  
提交时间:2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
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  |  
浏览/下载:17/0
  |  
提交时间:2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
期刊论文
Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81
作者:
Liu, Yun
;
Yu, Weiyuan
;
Sun, Xuemin
;
Wang, Fengfeng
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  |  
浏览/下载:9/0
  |  
提交时间:2022/02/17
Binary alloys
Dissolution
Electronics packaging
Energy dispersive spectroscopy
Intermetallics
Lead-free solders
Morphology
Needles
Scanning electron microscopy
Shear flow
Soldered joints
Soldering
Tin
Tin alloys
Tin metallography
Ultrasonic effects
Ultrasonic waves
Uranium metallography
Vanadium metallography
Design/methodology/approach
Dispersion strengthening
Energy dispersive X ray spectroscopy
Fractured surfaces
Grain morphologies
Grooves
Ultrasonic cavitation
Ultrasonic vibration
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating
期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:
Gao, Li-Yin
;
Wan, Peng
;
Liu, Zhi-Quan
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  |  
浏览/下载:6/0
  |  
提交时间:2021/02/02
Fe-Ni
Electrodeposition
Transmission electron microscopy (TEM)
Interfacial structure
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