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浏览/检索结果: 共10条，第1-10条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Wetting of monocrystalline silicon (100) surface by Sn-xAl (x = 0, 2.4 and 50 at.%) alloys and Al at 900 °C 期刊论文 Vacuum, 2020, 卷号: 177 作者:  Lin, Qiaoli;  Wang, Jianbin;  Sui, Ran;  Liu, Lu;  Li, Hui 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Aluminum  Binary alloys  Dissolution  Drops  Monocrystalline silicon  Morphology  Tin alloys  Viscous flow  Wetting  Interface evolution  Interfacial morphologies  Marangoni convection  Modified sessile drop method  Solid/liquid interfaces  Solute concentrations  Spreading dynamics  Viscous dissipation   Wetting Behavior of Molten SnAgCu-xTi on SiO2 Surface Under High Temperature 期刊论文 Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 5, 页码: 10114-10119 作者:  Wang, Jianbin;  Lin, Qiaoli;  Sui, Ran;  Ci, Wenjuan;  Ye, Changsheng 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Dissolution  Reaction products  Silica  Silicon  Wetting  Adsorption at interfaces  High melting point  High temperature  Liquid/solid interface  Modified sessile drop method  Product control  Spreading dynamics  Wetting behavior   Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 4, 页码: 90-96 作者:  Sui, Ran;  Lin, Qiaoli 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Contact angle  Copper alloys  Microstructure  Monocrystalline silicon  Oxide films  Silicon alloys  Silver alloys  Tin alloys  Titanium alloys  Titanium oxides  Active components  Dissolution-reprecipitation  Monocrystalline  Solid/liquid interfaces  Temperature dependent  Temperature-induced  Wetting behavior  Wetting mechanism   Wetting of graphite by molten Cu–xSn–yCr ternary alloys at 1373 K 期刊论文 Carbon, 2020, 卷号: 159, 页码: 561-569 作者:  Lin, Qiaoli;  Yang, Fan;  Yang, Hongyu;  Sui, Ran;  Shi, Yu 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Carbides  Chromium compounds  Copper alloys  Drops  Graphite  Surface segregation  Ternary alloys  Tin  Chromium carbide  Diffusion limited  Experimental approaches  Internal diffusion  Phase equilibriums  Segregation layers  Spreading dynamics  Wettability variation   Wetting behavior of Cu6Sn5 IMC by molten Sn 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 3, 页码: 33-37 作者:  Li, Fuxiang;  Wang, Jianbin;  Ye, Changsheng;  Lin, Qiaoli 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Activation energy  Binary alloys  Gold  Oxide films  Substrates  Tin compounds  Ion sputtering  Linear variation  Metallic substrate  Modified sessile drop method  Reaction limiteds  Spreading dynamics  Wetting behavior  Wetting process   Wetting of h-BN by molten Cu-8.8Zr-xTi ternary alloys at 1373 K 期刊论文 VACUUM, 2020, 卷号: 173 作者:  Lin, Qiaoli;  Wang, Le;  Sui, Ran;  Sharif, Muhammad Haroon 收藏  |  浏览/下载：13/0  |  提交时间：2020/06/02 Wettability  Joining  Spreading  Brazing   Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond 期刊论文 Applied Surface Science, 2020, 卷号: 504 作者:  Liao, Xinjiang;  He, Qiqi;  Lin, Qiaoli;  Mu, Dekui;  Huang, Hui 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Adsorption  Binary alloys  Chemical bonds  Chemical vapor deposition  Lead-free solders  Reaction kinetics  Synthetic diamonds  Tin compounds  Wetting  Bonding techniques  Chemical vapour deposition  CVD Diamond  Interface reactions  Polycrystalline CVD diamond  Precursor films  Sessile drop method  Spreading kinetics   Spreading and oscillation induced by liquid drop impacting onto sessile drop 期刊论文 European Journal of Mechanics, B/Fluids, 2020, 卷号: 79, 页码: 247-254 作者:  Liang, Gangtao;  Yu, Haibing;  Chen, Liuzhu;  Chen, Yang;  Shen, Shengqiang 收藏  |  浏览/下载：58/0  |  提交时间：2019/12/02 Biomimetic porous polypropylene foams with special wettability properties 期刊论文 COMPOSITES PART B-ENGINEERING, 2020, 卷号: 190 作者:  Huang, Pengke;  Wu, Fei;  Shen, Bin;  Zheng, Hao;  Ren, Qian 收藏  |  浏览/下载：82/0  |  提交时间：2020/12/16 MECHANICAL-PROPERTIES  COMPOSITES  MEMBRANE  SURFACES  FLOW   Wetting of monocrystalline silicon (100) surface by Sn0.3Ag0.7Cu-xTi (x=1 and 3wt%) alloys at 800–900°C 期刊论文 Microelectronics Reliability, 2020, 卷号: 104 作者:  Wang, Jianbin;  Lin, Qiaoli;  Li, Hui;  Mu, Dekui 收藏  |  浏览/下载：21/0  |  提交时间：2020/11/14 Copper alloys  Joining  Morphology  Silver alloys  Tin alloys  Titanium  Titanium alloys  Wetting  Active components  Melt spreading  Modified sessile drop method  Monocrystalline  Pyramidal hillocks  Pyramidal morphologies  Redeposition  Si substrates