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兰州理工大学 [13]
力学研究所 [3]
金属研究所 [2]
上海硅酸盐研究所 [2]
大连理工大学 [1]
北京航空航天大学 [1]
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期刊论文 [22]
学位论文 [1]
发表日期
2019 [23]
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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:
Cao Lihua
;
Chen Yinbo
;
Shi Qiyuan
;
Yuan Jie
;
Liu Zhiquan
收藏
  |  
浏览/下载:129/0
  |  
提交时间:2021/02/02
alloy element
Sn-Ag-Cu solder
intermetallic compound
interfacial morphology
shear strength
Effect of heat treatment on interface behavior of martensite/austenite multilayered composites by accumulative hot roll bonding
期刊论文
COMPOSITE INTERFACES, 2019, 卷号: 26, 期号: 12, 页码: 1069-1085
作者:
Cao, Rui
;
Ding, Yun
;
Yan, Yingjie
;
Zhang, Xiaobo
;
Chen, Jianhong
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/11/15
MLS composite plates
accumulative hot roll bonding
heat treatment
interface behavior
bonding mechanism
Microstructure and properties of functional magnesium titanate ceramic joint brazed by bismuth-borate glass
期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2019, 卷号: 39, 期号: 15, 页码: 4901
作者:
Jiang, Chonglai
;
Lin, Panpa
;
Chen, Qianqian
;
Wang, Ce
;
Lin, Tiesong
收藏
  |  
浏览/下载:322/0
  |  
提交时间:2019/12/26
Magnesium titanate ceramic
Bismuth-Borate glass braze
Interfacial reaction
Shear strength
Dielectric properties
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:
Yi, Xiong
;
Yi, Guangbin
;
Hu, Xiaowu
;
Li, Qinglin
;
Zhang, Ruhua
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Atomic force microscopy
Coatings
Copper compounds
Electroplating
Gold
Growth rate
Lead-free solders
Metallic films
Scanning electron microscopy
Semiconductor doping
Silver alloys
Silver metallography
Soldering
Substrates
Surface roughness
Ternary alloys
Thermal aging
Tin alloys
Tin compounds
Tin metallography
X ray photoelectron spectroscopy
Benzotriazole(BTA)
Electroplated Cu films
Heterocyclic compound
Interfacial microstructure evolution
Isothermal aging
Kovar substrates
Low concentrations
Soldering process
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
作者:
Jiang, Nan
;
Zhang, Liang
;
Liu, Zhi-quan
;
Sun, Lei
;
Xiong, Ming-yue
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浏览/下载:13/0
  |  
提交时间:2021/02/02
Microstructures and mechanical properties of A356/2024 bimetals fabricated by solid-liquid roll bonding
期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 10
作者:
Luo, Xiaomei
;
Chen, Tian-Ci
;
Li, Yuan-Dong
;
Zhou, Hongwei
;
Bi, Guang-Li
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/11/15
aluminum alloy
bimetal
solid-liquid roll bonding
interface
microstructure
shear strength
Influence of Brazing Filler Zn on Microstructure and Properties of Titanium/Aluminum Joint by Friction Stir Brazing
期刊论文
Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 9, 页码: 3067-3071 and 3100
作者:
Wu, Jingwei
;
Zhang, Zhongke
;
Che, Pengwei
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  |  
浏览/下载:17/0
  |  
提交时间:2020/11/14
Aluminum compounds
Binary alloys
Brazing
Ductile fracture
Fillers
Friction
Friction stir welding
Intermetallics
Microstructure
Scanning electron microscopy
Spectrometers
Temperature distribution
Temperature measurement
Ternary alloys
Titanium compounds
Zinc
Zinc alloys
Brazing fillers
Cross section microstructure
Energy dispersive spectrometers
Friction stir
Highest temperature
Microstructure and properties
Peak temperatures
TC4 and Al6082
The effective fracture strength and fracture toughness of solids with energy dissipation confined to localized strips
期刊论文
INTERNATIONAL JOURNAL OF PLASTICITY, 2019, 卷号: 120, 页码: 47-63
作者:
Zeng XG
;
Wei YJ(魏宇杰)
收藏
  |  
浏览/下载:49/0
  |  
提交时间:2019/09/09
Effective toughness
Fracture strength
Strain softening
Shear banding
Strip-yield model
Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film
期刊论文
VACUUM, 2019, 卷号: 167, 页码: 428-437
作者:
Hu, Xiaowu
;
Bao, Nifa
;
Li, Qinglin
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/11/15
Shear strength
Electroplated Cu
Aging
Kovar alloy
Microstructure
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