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过程工程研究所 [15]
兰州理工大学 [12]
大连化学物理研究所 [11]
湖南大学 [8]
金属研究所 [7]
上海应用物理研究所 [7]
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期刊论文 [125]
学位论文 [4]
会议论文 [2]
发表日期
2019 [131]
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天文学::恒星与银河... [1]
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Nanoscale Thermal Behavior of 2D SnSe Nanosheets
期刊论文
PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS, 2019
作者:
Li, Chunbo
;
Liu, Zhibin
;
Zeng, Huarong
;
Liu, Zhifu
;
Li, Yongxiang
收藏
  |  
浏览/下载:60/0
  |  
提交时间:2019/12/31
atomic force microscopy
nanoscale
SnSe nanosheets
thermal behaviour
Microwave plasma assisted reduction synthesis of hexagonal cobalt nanosheets with enhanced electromagnetic performances
期刊论文
NANOTECHNOLOGY, 2019, 卷号: 30, 期号: 49, 页码: 11
作者:
Piao, Mingxing
;
Zhang, Yilin
;
Feng, Shuanglong
;
Zhang, Heng
;
Zhang, Feng
收藏
  |  
浏览/下载:137/0
  |  
提交时间:2019/12/03
microwave plasma assisted reduction
morphology control technique
hexagonal Co nanosheets
enhanced electromagnetic properties
Exploring the friction and wear behaviors of Ag-Mo hybrid modified thermosetting polyimide composites at high temperature
期刊论文
FRICTION, 2019, 卷号: 5, 期号: 8, 页码: 893-904
作者:
Duan, Chunjian
;
He, Ren
;
Li, Song
;
Shao, Mingchao
;
Yang, Rui
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  |  
浏览/下载:126/0
  |  
提交时间:2021/01/28
polyimide
Ag-Mo hybrids
self-lubricating composites
high temperature tribology
Thermodynamic analysis and experimental verification for silicon recovery from the diamond wire saw silicon powder by vacuum carbothermal reduction
期刊论文
SEPARATION AND PURIFICATION TECHNOLOGY, 2019, 卷号: 228, 页码: 10
作者:
Yang, Shicong
;
Ma, Wenhui
;
Wei, Kuixian
;
Xie, Keqiang
;
Wang, Zhi
收藏
  |  
浏览/下载:59/0
  |  
提交时间:2019/10/18
Diamond wire saw silicon powder
Silicon recovery
Vacuum carbothermal reduction
Thermodynamic analysis
Experimental verification
Role of tool design on thermal cycling and mechanical properties of a high-speed micro friction stir welded 7075-T6 aluminum alloy
期刊论文
Journal of Manufacturing Processes, 2019, 卷号: 48, 期号: 48, 页码: 145-153
作者:
Yu, Ni
;
Li, Fu
;
Zhikang, Shen
;
Xiaochao, Liu
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  |  
浏览/下载:15/0
  |  
提交时间:2022/03/10
High-speed FSW
Pinless tool
Ultrathin sheet
AA7075-T6
Thickness reduction
Mechanical property
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:
Yi, Xiong
;
Yi, Guangbin
;
Hu, Xiaowu
;
Li, Qinglin
;
Zhang, Ruhua
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Atomic force microscopy
Coatings
Copper compounds
Electroplating
Gold
Growth rate
Lead-free solders
Metallic films
Scanning electron microscopy
Semiconductor doping
Silver alloys
Silver metallography
Soldering
Substrates
Surface roughness
Ternary alloys
Thermal aging
Tin alloys
Tin compounds
Tin metallography
X ray photoelectron spectroscopy
Benzotriazole(BTA)
Electroplated Cu films
Heterocyclic compound
Interfacial microstructure evolution
Isothermal aging
Kovar substrates
Low concentrations
Soldering process
Modulating the thermal conductivity of La2Zr2O7 by Thorium (Th) doping: an ab initio study
期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 11
作者:
Khan, Matiullah
;
Gul, S. R.
;
Zeng, Yi
;
Niaz, Abdul
;
Zaman, M. Iqbal
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  |  
浏览/下载:62/0
  |  
提交时间:2019/12/31
pyrochlore
thermal conductivity
thermal barrier doping
thorium
Numerically thermal analysis of a turbine vane at high temperature
会议论文
Novosibirsk, Russia, August 13, 2019 - August 16, 2019
作者:
Prapamonthon P
;
Yooyen S
;
Sleesongsom S
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  |  
浏览/下载:1/0
  |  
提交时间:2020/03/14
Understanding of temperature and cooling effectiveness sensitivity of a film-cooled vane under coolant inlet temperature effect: A case study
期刊论文
CASE STUDIES IN THERMAL ENGINEERING, 2019, 卷号: 14, 页码: UNSP 100505
作者:
Prapamonthon P
;
Yin B(银波)
;
Yang GW(杨国伟)
;
Zhang MH
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2020/03/21
TURBINE BLADE
HEAT-TRANSFER
Understanding of temperature and cooling effectiveness sensitivity of a film-cooled vane under coolant inlet temperature effect: A case study
期刊论文
CASE STUDIES IN THERMAL ENGINEERING, 2019, 卷号: 14, 页码: UNSP 100505
作者:
Prapamonthon P
;
Yin B(银波)
;
Yang GW(杨国伟)
;
Zhang MH
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/03/21
TURBINE BLADE
HEAT-TRANSFER
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