QQ客服 官方微博 反馈留言

浏览/检索结果: 共9条，第1-9条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Binary alloys  Copper compounds  Interface states  Intermetallics  Lead-free solders  Microstructure  Phase interfaces  Soldering  Tin compounds  Ultrasonic effects  Unmanned aerial vehicles (UAV)  Formation and evolutions  Growth patterns  IMC layer  Interfacial intermetallics  Liquid interface  Nonequilibrium state  Ultrasonic vibration   Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668 作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Bismuth alloys  Copper  Copper oxides  Joining  Oxide films  Phase interfaces  Soldering  Ternary alloys  Tin compounds  Wetting  Cu intermetallics  IMC layer  Interfacial reactivity  Interfacial structures  Sessile drop method  Sn-Bi alloy  Spreading characteristics  Ternary phase diagrams   Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 98, 页码: 112-118 作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran;  Ci, Wenjuan 收藏  |  浏览/下载：12/0  |  提交时间：2019/11/15 Wettability  Oxide film  Intermetallics  Joining   Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668 作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli 收藏  |  浏览/下载：7/0  |  提交时间：2019/11/15 Wettability  soldering  joining   Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771 作者:  Yu, Wei-Yuan;  Liu, Ying-Zong;  Wu, Wei-Jie;  Li, Fu-Xiang;  Xing, Chun-Xiao 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Binary alloys  Brazing  Copper compounds  Diffusion  Dissolution  Intermetallics  Lead-free solders  Phase interfaces  Tin alloys  Tin compounds  Cu-Sn intermetallics  Dissolution model  Evolution of the microstructure  Formation and evolutions  Formation mechanism  Planar shape  Soldering process  Solid-liquid interfaces   Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng 收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02 Chip scale packages  Copper  Copper alloys  Flip chip devices  Grain boundaries  Growth rate  Size determination  Soldered joints  Substrates  Tin alloys, Electronic product  Grain boundary motions  Interface reactions  Lateral growth rates  Longitudinal growth  Packaging process  Packaging technologies  Solder composition, Soldering   Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887 作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao 收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02 Binary alloys  Copper alloys  Film thickness  Intermetallics  Lead-free solders  Molluscs  Ostwald ripening  Soldering  Tin alloys, Cooling rates  Furnace cooling  Grain diameter  Growth behavior  Growth behaviour  Layer thickness  Non-uniformities  Reflow temperatures, Cooling   Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions 会议论文 2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01 作者:  Mu, G. Q.;  Qu, W. Q.;  Wu, Y. C.;  Zhuang, H. S. 收藏  |  浏览/下载：64/0  |  提交时间：2019/12/30 Binary alloys  Hardness  Mechanical properties  Microstructure  Soldering  Ternary alloys  Thermal aging  Tin alloys  Aging conditions  Aging temperatures  Fracture feature  Interfacial compounds  Interfacial microstructure evolution  Sn-based solders  Solder interfaces  Thermal aging tests  Gold alloys