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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2018     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K 期刊论文 Journal of Alloys and Compounds, 2018, 卷号: 767, 页码: 877-882 作者:  Lin, Qiaoli;  Li, Fuxiang;  Wang, Jianbin 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Copper oxides  Gold  Intermetallics  Joining  Lead-free solders  Oxide films  Oxide minerals  Soldering  Substrates  Tin  Cu intermetallics  Driving forces  Key factors  Lead-Free  Metallic substrate  Precipitation reaction  Sessile drop method  Thin oxide films   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ 收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05 Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength   High Frequency Induction Brazing Process of Copper-Steel and Its Effects on Microstructure and Electrical Conductivity of Weld Joint 期刊论文 Cailiao Daobao/Materials Review, 2018, 卷号: 32, 期号: 3, 页码: 909-914 作者:  Shi, Yu;  Gao, Haiming;  Li, Guang;  Li, Xiang 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Binary alloys  Brazing  Diffusion  Dissimilar metals  Electric conductivity  Induction heating  Lead-free solders  Microstructure  Morphology  Plate metal  Steel  Structure (composition)  Tin alloys  Tin oxides  Welding  Welds  316 stainless steel  Connection strength  Copper steel  Diffusion reaction layer  Dissimilar metal welding  Electrical conductivity  High frequency induction brazing  Welding temperatures   Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Ren, Jing;  Huang, Mingliang;  Yang, Xudong 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02 Lead-free solder  low temperature  Sn-Bi-Ag  mechanical property  microstructure  cluster-plus-glue-atom (CPGA) model