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浏览/检索结果: 共169条，第1-10条 帮助 限定条件 发表日期：2017    专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Gesture Interaction for Coronary Heart Diseases Based on Wavelet Transform and Semi-Continuous Hidden Markov Model in Augmented Reality 期刊论文 RECENT ADVANCES IN ELECTRICAL & ELECTRONIC ENGINEERING, 2017, 卷号: 10, 页码: 150-165 作者:  Gao, Mingke[1];  Chen, Yimin[2];  Zhang, Dianhua[3];  Li, Zeyu[4];  Jiang, Siyu[5] 收藏  |  浏览/下载：13/0  |  提交时间：2019/04/24 Augmented reality  coronary heart disease  gesture interaction  gesture recognition  semi-continuous hidden markov model  wavelet transform   Dynamic Multi-Task Learning with Convolutional Neural Network 会议论文 the 26th International Joint Conference on Artificial Intelligence, 2017-08-19 作者:  Yu-Chun Fang[1];  Zheng-Yan Ma[2];  Zhao-Xiang Zhang[3];  Xu-Yao Zhang[4];  Xiang Bai,[5] 收藏  |  浏览/下载：12/0  |  提交时间：2019/04/24 Low-energy Consumption and High-color-quality White Organic Light-emitting Diodes 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Tang, Zhenyu[1];  Guo, Kunping[2];  Si, Changfeng[3];  Pan, Saihu[4];  Wei, Bin[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/24 low-energy consumption  high color rendering index  color-temperature tunable  chromatic-stable   An evaluation method for the restored time-constant function based on the network identification by deconvolution method 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Shu, Wenhao[1];  Zhang, Jianhua[2];  Xu, Xiaoxue[3];  Yang, Lianqiao[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/24 network identification by deconvolution (NID)  signal to noise ratio  regularization method  Fourier domain deconvolution method   The Degradation of High Power Gallium Nitride Light-emitting Diodes 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  He PiaoPiao[1];  Zhou JiPeng[2];  Yin LuQiao[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/24 Gallium nitride  high power LED  degradation  defect concentration   Oxygen and Water Barrier Performance of the Composite Thin Film of Graphene and Polydimethylsiloxane (PDMS) 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Lin, Shiqi[1];  Chen, Zhangfu[2];  Xu, Xiaoxue[3];  Yang, Lianqiao[4];  Wei, Bin[5] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/24 graphene  PDMS  flexible substrate  Oxygen and Water Barrier Performance   Sintering process of mixed solvent system frit to improve the performance of the film in glass/glass laser bonding 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Li, Yi[1];  Tian, Rui[2];  Yin, Luqiao[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Solvent system  Glass frit  Thermal Gravimetric  Sintering process   Study on organic/inorganic hybrid light emitting diode 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Xu, Xiaoxue[1];  Chen, Zhangfu[2];  Tang, Zhenyu[3];  Wei, Bin[4];  Yang, Lianqiao[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24 organic-inorganic hybrid  n-GaN  fluorescence  electroluminance   Hermeticity Test of Low-Melting Point Sealing Glass and Analysis of Encapsulation Failure 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Tian, Rui[1];  Li, Yi[2];  Yin, Luqiao[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/24 Laser-Assisted Glass Frit Bonding (Laser bonding)  Bismuthate Sealing Glass  Phosphate vanadate Sealing Glass  Hermeticity Test  Analysis of Encapsulation Failures   Bumping UBM Metal Residue Defect Analysis and Improvement Using Techniques of Design of Experiment (DOE) 会议论文 PROCEEDINGS OF 2017 IEEE 2ND INFORMATION TECHNOLOGY, NETWORKING, ELECTRONIC AND AUTOMATION CONTROL CONFERENCE (ITNEC), 2017-01-01 作者:  Chen, Lin[1];  Chen, Chee-Cheng[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/24 design of experiment  bumping UBM metal residue  the semiconductor company