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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 发表日期：2016    内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Reliability variability simulation methodology for IC design: An EDA perspective 其他 2016-01-01 Zhang, Aixi; Huang, Chunyi; Guo, Tianlei; Chen, Alvin; Guo, Shaofeng; Wang, Runsheng; Huang, Ru; Xie, Jushan 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 Reliability and longer range for low power transmitters with on demand network MIMO 其他 2016-01-01 Weitnauer, Mary Ann; Lin, Qiongjie; Zhang, Huanyu; Tian, Hongxian; Nowlan, Sean; Nyengele, Gedeon; Chakkedath, Sajith Mohan; Slratigos, Jim 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 Reliability and Longer Range for Low Power Transmitters with On Demand Network MIMO 其他 2016-01-01 Weitnauer, Mary Ann; Lin, Qiongjie; Zhang, Huanyu; Tian, Hongxian; Nowlan, Sean; Nyengele, Gedeon; Chakkedath, Sajith Mohan; Stratigos, Jim 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 wireless sensor networks  successive interference cancellation  coordinated multipoint  network MIMO  SHANNON-THEORETIC APPROACH  MULTIPLE-ACCESS CHANNEL  ALOHA  INTERFERENCE  ARCHITECTURE  WIRELESS  SCHEME  CODES   A Novel PUF based on Cell Error Rate Distribution of STT-RAM 其他 2016-01-01 Zhang, Xian; Sun, Guangyu; Zhang, Yaojun; Chen, Yiran; Li, Hai; Wen, Wujie; Di, Jia 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 MEMORY   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他 2016-01-01 Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 THROUGH-SILICON VIAS