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Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Fan, M.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/09
Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Chen, Y.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology Wuhan
作者:  Huang ML(黄明亮);  Zhao N(赵宁)
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/09
Ag对Co3O4催化剂催化分解N2O的促进作用 会议论文
第十届全国环境催化与环境材料学术会议, 杭州, 2016-11-04
作者:  于海彪;  王新平
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/09


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