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	Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature
	Zubir, Noor Suhana Mohd; Zhang, Hongqiang; Zou, Guisheng; Bai, Hailin; Deng, Zhongyang; Feng, Bin; Wu, Aiping; Liu, Lei; Zhou, Y. Norman
刊名	JOURNAL OF ELECTRONIC MATERIALS
	2019
卷号	48页码:7562-7572
关键词	Organic-free Ag nanoparticle material large-area chip sintering die-attachment
ISSN号	0361-5235
DOI	10.1007/s11664-019-07532-9
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000488962300082
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5915973
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Zubir, Noor Suhana Mohd,Zhang, Hongqiang,Zou, Guisheng,et al. Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature[J]. JOURNAL OF ELECTRONIC MATERIALS,2019,48:7562-7572.
APA	Zubir, Noor Suhana Mohd.,Zhang, Hongqiang.,Zou, Guisheng.,Bai, Hailin.,Deng, Zhongyang.,...&Zhou, Y. Norman.(2019).Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature.JOURNAL OF ELECTRONIC MATERIALS,48,7562-7572.
MLA	Zubir, Noor Suhana Mohd,et al."Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature".JOURNAL OF ELECTRONIC MATERIALS 48(2019):7562-7572.

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