Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature | |
Zubir, Noor Suhana Mohd; Zhang, Hongqiang; Zou, Guisheng; Bai, Hailin; Deng, Zhongyang; Feng, Bin; Wu, Aiping; Liu, Lei; Zhou, Y. Norman | |
刊名 | JOURNAL OF ELECTRONIC MATERIALS |
2019 | |
卷号 | 48页码:7562-7572 |
关键词 | Organic-free Ag nanoparticle material large-area chip sintering die-attachment |
ISSN号 | 0361-5235 |
DOI | 10.1007/s11664-019-07532-9 |
URL标识 | 查看原文 |
收录类别 | SCIE ; EI |
WOS记录号 | WOS:000488962300082 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5915973 |
专题 | 北京航空航天大学 |
推荐引用方式 GB/T 7714 | Zubir, Noor Suhana Mohd,Zhang, Hongqiang,Zou, Guisheng,et al. Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature[J]. JOURNAL OF ELECTRONIC MATERIALS,2019,48:7562-7572. |
APA | Zubir, Noor Suhana Mohd.,Zhang, Hongqiang.,Zou, Guisheng.,Bai, Hailin.,Deng, Zhongyang.,...&Zhou, Y. Norman.(2019).Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature.JOURNAL OF ELECTRONIC MATERIALS,48,7562-7572. |
MLA | Zubir, Noor Suhana Mohd,et al."Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature".JOURNAL OF ELECTRONIC MATERIALS 48(2019):7562-7572. |
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