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	A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation
	Houfu Dai; Fa Zhang; Jianbin Chen
刊名	International Journal of Mechanical Sciences
	2019
卷号	Vol.157-158页码:254-266
关键词	Molecular dynamics Laser nano-structured diamond abrasive Mechanical polishing Subsurface damage
ISSN号	0020-7403
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4618300
专题	湖南大学
作者单位	1.b State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha 410082, China a College of Mechanical Engineering, Guizhou University, Guiyang 550025, China 2.School of Mechanical Engineering and Mechanics, Ningbo University, Ningbo 315211, China
推荐引用方式 GB/T 7714	Houfu Dai,Fa Zhang,Jianbin Chen. A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation[J]. International Journal of Mechanical Sciences,2019,Vol.157-158:254-266.
APA	Houfu Dai,Fa Zhang,&Jianbin Chen.(2019).A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation.International Journal of Mechanical Sciences,Vol.157-158,254-266.
MLA	Houfu Dai,et al."A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation".International Journal of Mechanical Sciences Vol.157-158(2019):254-266.

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