Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites | |
Dongqin Wan; Xinzhi Wu; Wei Zhang; Kun Peng | |
刊名 | Materials Research Bulletin |
2019 | |
页码 | 110606 |
关键词 | few-layer h-BN composites solvothermal method anisotropic thermal properties |
ISSN号 | 0025-5408 |
URL标识 | 查看原文 |
公开日期 | [db:dc_date_available] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4614344 |
专题 | 湖南大学 |
作者单位 | 1.a College of Materials Science and Engineering, Hunan University, 410082, Changsha, China 2.Hunan Engineering Technology Research Center for Microwave Devices and Equipment, Hunan University, 410082, Changsha, China |
推荐引用方式 GB/T 7714 | Dongqin Wan,Xinzhi Wu,Wei Zhang,et al. Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites[J]. Materials Research Bulletin,2019:110606. |
APA | Dongqin Wan,Xinzhi Wu,Wei Zhang,&Kun Peng.(2019).Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites.Materials Research Bulletin,110606. |
MLA | Dongqin Wan,et al."Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites".Materials Research Bulletin (2019):110606. |
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