| Modeling and experimental study of the kink formation process in wire bonding | |
| Wang, Fuliang*; Chen, Yun; Han, Lei | |
| 刊名 | IEEE Transactions on Semiconductor Manufacturing
 |
| 2014 | |
| 卷号 | 27期号:1页码:51-59 |
| 关键词 | Finite element (FE) model kink formation looping strain distribution thermosonic wire bonding |
| ISSN号 | 0894-6507 |
| DOI | 10.1109/TSM.2012.2225649 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000331325400007;EI:20140817360789 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3338125 |
| 专题 | 中南大学 |
| 作者单位 | 1.[Han, Lei 2.Wang, Fuliang 3.Chen, Yun] Cent S Univ, Sch Mech & Elect Engn, State Key Lab High Performance Complex Mfg, Changsha 410083, Hunan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Fuliang*,Chen, Yun,Han, Lei. Modeling and experimental study of the kink formation process in wire bonding[J]. IEEE Transactions on Semiconductor Manufacturing,2014,27(1):51-59. |
| APA | Wang, Fuliang*,Chen, Yun,&Han, Lei.(2014).Modeling and experimental study of the kink formation process in wire bonding.IEEE Transactions on Semiconductor Manufacturing,27(1),51-59. |
| MLA | Wang, Fuliang*,et al."Modeling and experimental study of the kink formation process in wire bonding".IEEE Transactions on Semiconductor Manufacturing 27.1(2014):51-59. |
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