Modeling and experimental study of the kink formation process in wire bonding | |
Wang, Fuliang*; Chen, Yun; Han, Lei | |
刊名 | IEEE Transactions on Semiconductor Manufacturing |
2014 | |
卷号 | 27期号:1页码:51-59 |
关键词 | Finite element (FE) model kink formation looping strain distribution thermosonic wire bonding |
ISSN号 | 0894-6507 |
DOI | 10.1109/TSM.2012.2225649 |
URL标识 | 查看原文 |
WOS记录号 | WOS:000331325400007;EI:20140817360789 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3338125 |
专题 | 中南大学 |
作者单位 | 1.[Han, Lei 2.Wang, Fuliang 3.Chen, Yun] Cent S Univ, Sch Mech & Elect Engn, State Key Lab High Performance Complex Mfg, Changsha 410083, Hunan, Peoples R China. |
推荐引用方式 GB/T 7714 | Wang, Fuliang*,Chen, Yun,Han, Lei. Modeling and experimental study of the kink formation process in wire bonding[J]. IEEE Transactions on Semiconductor Manufacturing,2014,27(1):51-59. |
APA | Wang, Fuliang*,Chen, Yun,&Han, Lei.(2014).Modeling and experimental study of the kink formation process in wire bonding.IEEE Transactions on Semiconductor Manufacturing,27(1),51-59. |
MLA | Wang, Fuliang*,et al."Modeling and experimental study of the kink formation process in wire bonding".IEEE Transactions on Semiconductor Manufacturing 27.1(2014):51-59. |
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