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	A thermal bonding method based on O-2 plasma and water treatment for fabrication of PET planar nanofluidic device
	Chen, Li; Yin, Zhifu; Zou, Helin; Liu, Junshan; Liu, Chong; Li, Kehong
刊名	3rd International Conference of Smart Systems Engineering (SmaSys)
	2017
卷号	23页码:1327-1333
ISSN号	0946-7076
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3285665
专题	大连理工大学
作者单位	1.Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, 116024, China |Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, 116024, China 2.Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, 116024, China 3.Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, 116024, China
推荐引用方式 GB/T 7714	Chen, Li,Yin, Zhifu,Zou, Helin,et al. A thermal bonding method based on O-2 plasma and water treatment for fabrication of PET planar nanofluidic device[J]. 3rd International Conference of Smart Systems Engineering (SmaSys),2017,23:1327-1333.
APA	Chen, Li,Yin, Zhifu,Zou, Helin,Liu, Junshan,Liu, Chong,&Li, Kehong.(2017).A thermal bonding method based on O-2 plasma and water treatment for fabrication of PET planar nanofluidic device.3rd International Conference of Smart Systems Engineering (SmaSys),23,1327-1333.
MLA	Chen, Li,et al."A thermal bonding method based on O-2 plasma and water treatment for fabrication of PET planar nanofluidic device".3rd International Conference of Smart Systems Engineering (SmaSys) 23(2017):1327-1333.

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