A thermal bonding method based on O-2 plasma and water treatment for fabrication of PET planar nanofluidic device | |
Chen, Li; Yin, Zhifu; Zou, Helin; Liu, Junshan; Liu, Chong; Li, Kehong | |
刊名 | 3rd International Conference of Smart Systems Engineering (SmaSys)
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2017 | |
卷号 | 23页码:1327-1333 |
ISSN号 | 0946-7076 |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3285665 |
专题 | 大连理工大学 |
作者单位 | 1.Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, 116024, China |Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, 116024, China 2.Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, 116024, China 3.Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, 116024, China |
推荐引用方式 GB/T 7714 | Chen, Li,Yin, Zhifu,Zou, Helin,et al. A thermal bonding method based on O-2 plasma and water treatment for fabrication of PET planar nanofluidic device[J]. 3rd International Conference of Smart Systems Engineering (SmaSys),2017,23:1327-1333. |
APA | Chen, Li,Yin, Zhifu,Zou, Helin,Liu, Junshan,Liu, Chong,&Li, Kehong.(2017).A thermal bonding method based on O-2 plasma and water treatment for fabrication of PET planar nanofluidic device.3rd International Conference of Smart Systems Engineering (SmaSys),23,1327-1333. |
MLA | Chen, Li,et al."A thermal bonding method based on O-2 plasma and water treatment for fabrication of PET planar nanofluidic device".3rd International Conference of Smart Systems Engineering (SmaSys) 23(2017):1327-1333. |
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