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	Breakdown of Shape Memory Effect in Bent Cu-Al-Ni Nanopillars: When Twin Boundaries Become Stacking Faults
	Liu, Lifeng; Ding, Xiangdong; Sun, Jun; Li, Suzhi; Salje, Ekhard K. H.
刊名	NANO LETTERS
	2016
卷号	16期号:[db:dc_citation_issue]页码:194-198
关键词	finite size scaling Cu-Al-Ni alloys size dependence of shape memory shape memory effect twinning stacking faults
ISSN号	1530-6984
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3230915
专题	西安交通大学
推荐引用方式 GB/T 7714	Liu, Lifeng,Ding, Xiangdong,Sun, Jun,et al. Breakdown of Shape Memory Effect in Bent Cu-Al-Ni Nanopillars: When Twin Boundaries Become Stacking Faults[J]. NANO LETTERS,2016,16([db:dc_citation_issue]):194-198.
APA	Liu, Lifeng,Ding, Xiangdong,Sun, Jun,Li, Suzhi,&Salje, Ekhard K. H..(2016).Breakdown of Shape Memory Effect in Bent Cu-Al-Ni Nanopillars: When Twin Boundaries Become Stacking Faults.NANO LETTERS,16([db:dc_citation_issue]),194-198.
MLA	Liu, Lifeng,et al."Breakdown of Shape Memory Effect in Bent Cu-Al-Ni Nanopillars: When Twin Boundaries Become Stacking Faults".NANO LETTERS 16.[db:dc_citation_issue](2016):194-198.

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