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Wavelength conversion member 专利
专利号: WO2019156159A1, 申请日期: 2019-08-15, 公开日期: 2019-08-15
作者:  ARAI, YUSUKE;  ITO, AKIRA;  IIZUKA, KAZUYUKI;  SUZUKI, RIKIYA;  YAMASHITA, YOSHIHIRO
收藏  |  浏览/下载:17/0  |  提交时间:2019/12/31
Performing pre-heating and heat treatment of complex component by laser cladding involves determining trajectory of laser and laser cladding parameters on the basis of shape of workpiece, and selecting crystals having small particle size. 专利
申请日期: 2016-01-01, 公开日期: 2016-06-01
作者:  LI H LI T XU H ZHANG H ZHANG S WANG
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/09
一种快速无模板的细胞图形化方法 专利
专利类型: 发明, 专利号: CN104328084A, 申请日期: 2015-02-04,
作者:  刘连庆;  刘娜;  李文荣;  王越超;  于海波
收藏  |  浏览/下载:31/0  |  提交时间:2015/07/01
Method for preparing shape-controllable core-case particle, involves heating metal raw material at specific temperature so as to obtain melting portion. 专利
申请日期: 2013-01-01, 公开日期: 2013-04-03
作者:  XU F FU M DONG W
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/13
Particle class material shape selection device, has embedded control system that controls working of electronic balance, collects and transmits data, and monitors working state of whole machine and alarm for fault. 专利
申请日期: 2011-01-01, 公开日期: 2011-04-13
作者:  LI M CONG P JIANG Z
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/18
Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting 专利
专利号: EP2128201A1, 申请日期: 2009-12-02, 公开日期: 2009-12-02
作者:  MIYAWAKI, YOSHITERU;  TANAKA, OSAMU
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/30
Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient similar to that of semiconductor and method for manufacturing the same 专利
专利号: EP1282166A2, 申请日期: 2003-02-05, 公开日期: 2003-02-05
作者:  TSUJIOKA, MASANORI;  MATSUMURA, JUNZOH
收藏  |  浏览/下载:14/0  |  提交时间:2019/12/31
Heat radiation plate 专利
专利号: JP1990026057A, 申请日期: 1990-01-29, 公开日期: 1990-01-29
作者:  KIMURA MITSUO;  NUMATA MASAYUKI;  MANABE YUJI;  MATSUMURA YOSHIO
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/31


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