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科研机构
武汉岩土力学研究所 [8]
清华大学 [5]
中国地质调查局 [5]
北京大学 [4]
深圳先进技术研究院 [3]
半导体研究所 [3]
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期刊论文 [38]
会议论文 [6]
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2023 [1]
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光电子学 [3]
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Numerical investigation of debris flow-structure interactions in the Yarlung Zangbo River valley, north Himalaya, with a novel integrated approach considering structural damage
期刊论文
ACTA GEOTECHNICA, 2023, 卷号: 18, 期号: 11, 页码: 5859-5881
作者:
Bao, Yiding
;
Su, Lijun
;
Chen, Jianping
;
Zhang, Chonglei
;
Zhao, Bo
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2024/02/27
Debris flow
Dynamic process
Fluid-structure interaction
SPH-FDEM
Structure damage
Measurement of ejection velocity of rock fragments under dynamic compression and insight into energy partitioning
期刊论文
INTERNATIONAL JOURNAL OF ROCK MECHANICS AND MINING SCIENCES, 2022, 卷号: 149, 页码: 11
作者:
Xing, Haozhe
;
Wang, Mingyang
;
Ju, Minghe
;
Li, Jianchun
;
Li, Xiaofeng
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  |  
浏览/下载:86/0
  |  
提交时间:2022/02/17
Dynamic compression
Rock fragmentation
Ejection velocity
3D digital image correlation
Energy partitioning
Inversion of the 3D in situ stress field in a complex valley area around the underground cavern group of the Yingliangbao Hydropower Station
期刊论文
IOP Conference Series: Earth and Environmental Science, 2021, 卷号: 861, 期号: 2
作者:
Zheng,Hong
;
Yan,Shengcun
;
Chen,Tao
;
Jiang,Quan
;
Xiong,Xiantao
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  |  
浏览/下载:33/0
  |  
提交时间:2022/01/05
Estimation of the three-dimensional in situ stress field around a large deep underground cavern group near a valley
期刊论文
JOURNAL OF ROCK MECHANICS AND GEOTECHNICAL ENGINEERING, 2021, 卷号: 13, 期号: 3, 页码: 529-544
作者:
Xu, Dingping
;
Huang, Xiang
;
Jiang, Quan
;
Li, Shaojun
;
Zheng, Hong
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  |  
浏览/下载:19/0
  |  
提交时间:2021/08/11
Underground cavern group
In situ stress
Stress-induced brittle failure
Spalling depth
Numerical simulation
Mechanical design of the magnet mirror structure for testing Nb3Sn sextupole coil of 45 GHz ECRIS
期刊论文
CRYOGENICS, 2020, 卷号: 112, 页码: 5
作者:
Zhu, L.
;
Wu, W.
;
Yu, S. R.
;
Sun, L. T.
;
Chen, Y. Y.
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  |  
浏览/下载:6/0
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提交时间:2021/12/10
Mirror structure
Nb3Sn sextupole coil
Mechanical design of the magnet mirror structure for testing Nb3Sn sextupole coil of 45 GHz ECRIS
期刊论文
Cryogenics, 2020, 卷号: 112
作者:
Zhu, L.
;
Wu, W.
;
Yu, S.R.
;
Sun, L.T.
;
Chen, Y.Y.
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  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Binary alloys
Magnets
Mirrors
Mobile telecommunication systems
Niobium alloys
Optical testing
Stress analysis
Superconducting coils
Superconducting magnets
Fourth generation
Mechanical analysis
Mechanical design
Mechanical model
Mirror structure
Realistic conditions
Shell-based structures
Three dimensional finite elements
Three-Dimensional Graphene Composite Containing Graphene-SiO2 Nanoballs and Its Potential Application in Stress Sensors
期刊论文
NANOMATERIALS, 2019, 卷号: 9, 期号: 3, 页码: 11
作者:
Zhao, Bowei
;
Sun, Tai
;
Zhou, Xi
;
Liu, Xiangzhi
;
Li, Xiaoxia
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  |  
浏览/下载:51/0
  |  
提交时间:2019/06/03
graphene
three-dimensional structure
stress sensor
A Novel in Situ Stress Monitoring Technique for Fracture Rock Mass and Its Application in Deep Coal Mines
期刊论文
APPLIED SCIENCES-BASEL, 2019, 卷号: 9, 期号: 18, 页码: -
作者:
Liu, Bin
;
Zhu, Yuanguang
;
Liu, Quansheng
;
Liu, Xuewei
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  |  
浏览/下载:23/0
  |  
提交时间:2020/04/08
In situ stress
rheological stress recovery
three-dimensional sensor
monitoring
underground engineering
Evaluation of sulfane sulfur bioeffects via a mitochondria-targeting selenium-containing near-infrared fluorescent probe
期刊论文
BIOMATERIALS, 2018, 卷号: 160, 页码: 1-14
作者:
Gao, Min
;
Wang, Rui
;
Yu, Fabiao
;
Chen, Lingxin
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  |  
浏览/下载:17/0
  |  
提交时间:2020/07/08
Fluorescent probes
Sulfane sulfur
Mitochondria-targeting
In vivo bioimaging
Hypoxia stress
Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon
会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:
Li, T.
;
Yao, R.
;
Yu, C.
;
Su, F.
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/30
Cracks
Elasticity
Electronics packaging
Light polarization
Microscopes
Optical devices
Silicon carbide
Silicon wafers
Stresses
Wafer bonding
Wide band gap semiconductors
Electronic Packaging
Heating platform
Phase difference
Quarter wave-plate
Si-based materials
Silicon-based materials
Stress birefringence
Temperature cycling tests
Three dimensional integrated circuits
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