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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：西安交通大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Numerical modeling of the gas-contributed thermal conductivity of aerogels 期刊论文 International Journal of Heat and Mass Transfer, 2019, 卷号: 131, 页码: 217-225 作者:  Zhu, Chuan-Yong;  Li, Zeng-Yao;  Pang, Hao-Qiang;  Pan, Ning 收藏  |  浏览/下载：141/0  |  提交时间：2019/11/19 Aerogel structures  Complex microstructures  Diffusion-limited cluster-cluster aggregations  Gasphase  Heat transfer mechanism  Micro-structural characteristics  Numerical methodologies  Thermal coupling   Aluminizing mechanism on a nickel-based alloy with surface nanostructure produced by laser shock peening and its effect on fatigue strength 期刊论文 SURFACE & COATINGS TECHNOLOGY, 2018, 卷号: 342, 页码: 29-36 作者:  Luo Sihai;  He Weifeng;  Zhou Liucheng;  Nie Xiangfan;  Li Yinghong 收藏  |  浏览/下载：16/0  |  提交时间：2019/11/26 K417 nickel-based alloy  Fatigue strength  Diffusion mechanism  Surface nanostructure  Gas aluminizing  Laser shock peening   Analysis of LNA under multi-pulses IEMI 会议论文 作者:  Li, Yong;  Xie, Haiyan;  Xuan, Chun;  Wang, Jianguo 收藏  |  浏览/下载：4/0  |  提交时间：2019/11/26 Damage mechanism  Drift-diffusion model  High power microwaves  IEMI  Interference pulse  Recovery time  Sensitive parameter  Simulation algorithms   Modelling of flame structure using thickened flame model coupled with multi-step reaction mechanism 会议论文 作者:  Shilong, Guo;  Meng, Zhang;  Jinhua, Wang;  Zuohua, Huang 收藏  |  浏览/下载：3/0  |  提交时间：2019/11/26 Combustion phenomena  Heat Release Rate (HRR)  Multi-step mechanism  Multistep reactions  Reaction mechanism  Species concentration  Species diffusion  Thickened flames   A potentiometric oxygen sensor based on LaF3using Pt micro grid as the sensing electrode 会议论文 作者:  Sun, Guoliang;  Wang, Hairong;  Jiang, Zhuangde;  Ren, Junqiang 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/10 Diffusion process  Electromotive force (EMF)  Micro grid  Potentiometric oxygen sensor  Reference electrodes  Sensing mechanism  Solid state gas sensors  Sputtering techniques   Stress relaxation behavior of Cu thin films in electro-thermo-mechanical multiple fields 会议论文 作者:  Wang, Z.J.;  Sun, B.;  Huang, L.;  Liu, G.;  Ding, X.D. 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/18 Copper thin film  Dominant mechanism  Grain-boundary diffusion  Hillock formation  Low temperatures  Stress relaxation behavior  Thermo-mechanical  Wafer curvature methods