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Microstructure and Thermal Stability of MoC Doped Ru-Based Alloy Films as Seedless Diffusion Barrier 期刊论文
ACTA METALLURGICA SINICA, 2017, 卷号: Vol.53 No.1, 页码: 31-37
作者:  Zou, JX;  Liu, B;  Lin, LW;  Ren, D;  Jiao, GH
收藏  |  浏览/下载:7/0  |  提交时间:2019/02/28
Interface stability and microstructure of ultrathin Mo/MoN diffusion barrier in Cu interconnects 期刊论文
MATERIALS RESEARCH INNOVATIONS, 2013
作者:  Liu, C. H.;  Jin, Y. Z.;  Cui, X. J.;  Yang, R. S.;  Fu, Q. S.
收藏  |  浏览/下载:5/0  |  提交时间:2019/02/25
Interface stability and microstructure of an ultrathin alpha-Ta/graded Ta(N)/TaN multilayer diffusion barrier 期刊论文
Microelectronic Engineering, 2012, 卷号: Vol.98, 页码: 80-84
作者:  Liu, CH;  Liu, W;  Wang, YH;  Wang, Y;  An, Z
收藏  |  浏览/下载:1/0  |  提交时间:2019/03/26
Preparation and Properties Characterization of Gradient alpha-Ta(N)/TaN Bi-layer Diffusion Barrier 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2012, 卷号: Vol.41 No.10, 页码: 1855-1858
作者:  Liu, CH;  Luo, H;  Jin, YZ;  Song, ZX;  Chen, SL
收藏  |  浏览/下载:1/0  |  提交时间:2019/03/26
Design and fabrication of ultrathin and highly thermal-stable α-Ta/graded Ta/TaN multilayer as diffusion barrier for Cu interconnects 期刊论文
Journal of Physics, D. Applied Physics: A Europhysics Journal, 2011, 卷号: Vol.44 No.7, 页码: 075302(1-6)
作者:  Liu, C.H.;  Wang, Y.;  Liu, B.;  An, Z.;  Song, Z.X.
收藏  |  浏览/下载:1/0  |  提交时间:2019/02/25
Design and fabrication of ultrathin and highly thermal-stable α-Ta/graded Ta(N)/TaN multilayer as diffusion barrier for Cu interconnects 期刊论文
Journal of Physics D: Applied Physics, 2011
作者:  C H Liu;  Y Wang;  B Liu;  Z An;  Z X Song
收藏  |  浏览/下载:1/0  |  提交时间:2019/02/25


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