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Preliminary Study of a New Process to Improve the Strength of Thermo-sonic Ball Solder Joint 会议论文
2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Qingdao, China
作者:  Zhai Yu;  Zhao Wang;  Jun Cheng;  Hw Tian
收藏  |  浏览/下载:10/0  |  提交时间:2015/08/21
coupa: operation with pen linking on mobile devices 会议论文
Living in a world as colorful as you - 11th International Conference on Human-Computer Interaction with Mobile Devices and Services, MobileHCI 2009, Bonn, Germany, September
Yu Kun; Tian Feng; Wang Kongqiao
收藏  |  浏览/下载:12/0  |  提交时间:2011/03/20
A Fuzzy RBAC Model Described by XML-Graph 会议论文
International Conference on Scalable Computing and Communications/8th International Conference on Embedded Computing, Dalian, PEOPLES R CHINA, 2009-09-25
作者:  Tian Jia;  Guo He;  Wang Yu-Xin;  Wang Zheng
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/24
RECENT RESULTS FROM BESII J/psi DECAYS 会议论文
作者:  Dai, Y. S.;  Zou, B. S.;  Zhuang, B. A.;  Zhu, Z. L.;  Zhou, L.
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/05


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