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Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：19/0  |  提交时间：2020/11/14
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文
Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin
收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14
Microthrombus-Targeting Micelles for Neurovascular Remodeling and Enhanced Microcirculatory Perfusion in Acute Ischemic Stroke 期刊论文
ADVANCED MATERIALS, 2019, 卷号: 31, 期号: 21
作者:  Liu, Peixin;  Guo, Qin;  Zhang, Yu;  Chen, Xinli;  Zhang, Yujie
收藏  |  浏览/下载：28/0  |  提交时间：2019/12/05
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
The Measurement of Optical Interconnect Module Postsoldering Alignment Offsets and the Study of Its Influence on Optical Coupling Efficiency 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 卷号: Vol.9 No.2, 页码: 380-387
作者:  Huang, Chunyue;  Lu, Liangkun;  Shao, Liangbin;  Liang, Ying
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/13
Fabrication of Fabry-Perot-cavity-based monolithic full-color filter arrays using a template-confined micro-reflow process 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2019, 卷号: Vol.29 No.2
作者:  Wang, YS;  Zhu, XP;  Chen, YQ;  Shi, HM;  Li, ZQ
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/17
Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Huang, Ru;  Xia, Mengrou;  Yao, Jinye;  Wang, Boyin;  Qi, Xiao
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Numerical simulation of supersonic separator with axial or tangential outlet in reflow channel 期刊论文
CHEMICAL ENGINEERING AND PROCESSING, 2018, 卷号: 124, 页码: 109-121
作者:  Hu, Dapeng;  Wang, Yingguang;  Ma, Cheng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Wang, Y. P.;  Chen, J.;  Ma, H. T.;  Zhao, N.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Application of the Microlens Array in the projection of the Laser Scanning 会议论文
作者:  Wang, Lulu;  Li, Min;  Tan, Hai;  Zhou, Peng;  Bai, Yu
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/26

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