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期刊论文 [33]
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A Double PUF-based RFID Identity Authentication Protocol in Service-Centric Internet of Things Environments
期刊论文
Information Sciences, 2019
作者:
Wei Liang
;
Songyou Xie
;
Jing Long
;
Kuan-Ching Li
;
Dafang Zhang
收藏
|
浏览/下载：65/0
|
提交时间：2019/12/13
Authentication
Integrated circuit (IC)
Internet of things (IoT)
Physical unclonable function (PUF)
Radio frequency identification (RFID)
A double PUF-based RFID identity authentication protocol in service-centric internet of things environments
期刊论文
Information Sciences, 2019, 卷号: Vol.503, 页码: 129-147
作者:
Wei Liang
;
Songyou Xie
;
Jing Long
;
Kuan-Ching Li
;
Dafang Zhang
收藏
|
浏览/下载：7/0
|
提交时间：2019/12/13
Authentication
Integrated circuit (IC)
Internet of things (IoT)
Physical unclonable function (PUF)
Radio frequency identification (RFID)
A double PUF-based RFID identity authentication protocol in service-centric internet of things environments
期刊论文
INFORMATION SCIENCES, 2019, 卷号: Vol.503, 页码: 129-147
作者:
Liang, W
;
Xie, SY
;
Long, J
;
Li, KC
;
Zhang, DF
收藏
|
浏览/下载：5/0
|
提交时间：2019/12/17
Authentication
Integrated circuit (IC)
Internet of things (IoT)
Physical unclonable function (PUF)
Radio frequency identification (RFID)
A high-pass filter based on through-silicon via (TSV)
期刊论文
2019, 卷号: 16, 页码: 1-3
作者:
Wang, Fengjuan
;
Huang, Jia
;
Yu, Ningmei
收藏
|
浏览/下载：8/0
|
提交时间：2019/12/20
through-silicon via (TSV)
high-pass filter
three-dimensional integrated circuit (3D IC)
A novel guard method of through-silicon-via (TSV)
期刊论文
2018, 卷号: 15
作者:
Wang, Fengjuan
;
Huang, Jia
;
Yu, Ningmei
收藏
|
浏览/下载：3/0
|
提交时间：2019/12/20
through-silicon-via (TSV)
guard method
PN junction
three-dimensional integrated circuit (3D IC)
An On-Chip Dynamically Obfuscated Wrapper for Protecting Supply Chain Against IP and IC Piracies
期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2018, 卷号: 26, 页码: 2456-2469
作者:
Zhang, Dongrong
;
Wang, Xiaoxiao
;
Rahman, Md. Tauhidur
;
Tehranipoor, Mark
收藏
|
浏览/下载：5/0
|
提交时间：2019/12/30
Authentication
counterfeit
integrated circuit (IC) piracy
intellectual property (IP) piracy
overproduction
ownership certification
supply chain security
The mathematical model and novel final test system for wafer-level packaging
期刊论文
IEEE Transactions on Industrial Informatics, 2017, 卷号: 13, 期号: 4, 页码: 1817-1824
作者:
Li, Junhui*
;
Tian, Wenya
;
Liao, Hailong
;
Zhou, Can
;
Liu, Xiaohe
收藏
|
浏览/下载：10/0
|
提交时间：2019/12/03
Automatic final test
integrated circuit (IC) modeling
mathematical model
measurement techniques
microprobe final test
through-silicon vias
Analytical Model for 3D IC Temperature Considering Lateral Heat Conduction
会议论文
2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2017-01-01
作者:
Wang, Fengjuan
;
Yu, Ningmei
收藏
|
浏览/下载：5/0
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提交时间：2019/12/20
Temperature
three-dimensional integrated circuit (3D IC)
lateral heat conduction
Fourier heat flow analysis theory
Enhancement of Thermal Stability (T-g >= 260 degrees C) of Ether-bridged Fluorinated Poly(phenylquinoxaline)s with Excellent Dielectric Properties and Water Repellent Characteristics
期刊论文
CHEMISTRY LETTERS, 2016, 卷号: 45, 期号: 6, 页码: 607-609
作者:
Zhang, Xiu-min
;
Ni, Hong-jiang
;
Liu, Jin-gang
;
Yang, Shi-yong
收藏
|
浏览/下载：20/0
|
提交时间：2017/01/18
Integrated circuit (IC)
Glass-transition temperature
Low dielectric constant (low-k)
Trusted Integrated Circuits: The Problem and Challenges
期刊论文
2016, 2016
吕勇强
;
周强
;
蔡懿慈
;
屈钢
;
Yong-Qiang Lv
;
Qiang Zhou
;
Yi-Ci Cai
;
Gang Qu
收藏
|
浏览/下载：4/0
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