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兰州理工大学 [9]
华南理工大学 [4]
金属研究所 [3]
山东大学 [3]
清华大学 [2]
西安交通大学 [2]
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期刊论文 [27]
会议论文 [7]
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Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires
期刊论文
ADVANCED ENGINEERING MATERIALS, 2022, 页码: 13
作者:
Sun, Pengfei
;
Li, Zhiwei
;
Hou, Jiapeng
;
Xu, Aimin
;
Wang, Qiang
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/07/01
annealing
electrical conductivity
microstructure evolution
oxygen-free copper wire
strength
Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires
期刊论文
ADVANCED ENGINEERING MATERIALS, 2022
作者:
Sun, Pengfei
;
Li, Zhiwei
;
Hou, Jiapeng
;
Xu, Aimin
;
Wang, Qiang
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2022/04/21
annealing
electrical conductivity
microstructure evolution
oxygen-free copper wire
strength
Effect of fifferent filler wires on mechanical property and conductivity of aluminum-copper joints
期刊论文
Materials, 2020, 卷号: 13, 期号: 16
作者:
Zhang, Hengming
;
Shi, Yu
;
Gu, Yufen
;
Li, Chunkai
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Aluminum
Binary alloys
Brazing
Copper
Fillers
Gas metal arc welding
Gas welding
Intermetallics
Microhardness
Silicon
Tensile strength
Wire
Aluminum silicons
Aluminum-copper
Aluminum-magnesium
Brazing interface
Double electrodes
Element contents
Intermetallic compound layer
Pure aluminum
High ampacity of superhelix graphene/copper nanocomposite wires by a synergistic growth-twisting-drawing strategy.
期刊论文
Carbon, 2019, 卷号: Vol.141, 页码: 198-208
作者:
Zhao, Kai
;
Zhang, Tengfei
;
Ren, Ai
;
Yang, Yang
;
Xiao, Peishuang
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/17
GRAPHENE
*COPPER
*NANOCOMPOSITE
materials
*COPPER
wire
*CRYSTAL
growth
*METALLIC
composites
*CARBON
Correlation of temperature with galvanic corrosion behaviour of copper alloys based on wire beam electrode
期刊论文
CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, 2018, 卷号: 53, 页码: 331-339
作者:
Chen, Chuan[1]
;
Xu, Yun-Xiang[2]
;
Zhong, Qing-Dong[3]
;
Li, Yu- Lin[4]
;
Cheng, Y. Frank[5]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/22
Galvanic corrosion behaviour
copper and copper alloys
chloride solution
wire beam electrode
temperature environment
Microfabrication of conductive copper patterns by meniscus-confined electrodeposition
期刊论文
INTEGRATED FERROELECTRICS, 2018, 卷号: 190, 页码: 164-172
作者:
Lei, Yu[1]
;
Gao, Fangpu[2]
;
Guo, Jianjun[3]
;
Xu, Gaojie[4]
;
Yang, Yitao[5]
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/04/22
Microfabrication
electrodeposition
copper wire
meniscus
3D printing
Spontaneous and Directional Bubble Transport on Porous Copper Wires with Complex Shapes in Aqueous Media
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 页码: 3076-3081
作者:
Li, Wenjing
;
Zhang, Jingjing
;
Xue, Zhongxin
;
Wang, Jingming
;
Jiang, Lei
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/30
aerophilic copper wire
gas bubble
complex shapes
directional transport
gradient of Laplace pressure
Verification of a novel micro-torsion tester based on electromagnetism using an improved torsion pendulum technique
期刊论文
MEASUREMENT, 2017, 卷号: 105, 页码: 41-44
作者:
Liu W
;
Huan Y(郇勇)
;
Wang SF
;
Chen B
;
Dong J
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2017/07/24
Micro-torsion
Shear modulus
Torsion pendulum
Copper wire
Effect of Filler Wires on Brazing Interface Microstructure and Mechanical Properties of Al/Cu Dissimilar Metals Welding-Brazing Joint
期刊论文
Cailiao Daobao/Materials Review, 2017, 卷号: 31, 期号: 5, 页码: 61-64
作者:
Shi, Yu
;
Zhou, Xianglong
;
Zhu, Ming
;
Gu, Yufen
;
Fan, Ding
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Aluminum compounds
Binary alloys
Brazing
Copper alloys
Copper compounds
Dissimilar metals
Filler metals
Fillers
Gas metal arc welding
Gas welding
Intermetallics
Laser beam welding
Mechanical properties
Metals
Microstructure
Tensile strength
Welds
Wire
Brazing interface
Double electrodes
Filler materials
Filler wire
Growth of intermetallics
Intermetallic compound layer
MIG welding
Welding joints
Geometric Shape Induced Small Change of Seebeck Coefficient in Bulky Metallic Wires
期刊论文
SENSORS, 2017
Li, Gang
;
Su, Xiaohui
;
Yang, Fan
;
Huo, Xiaoye
;
Zhang, Gengmin
;
Xu, Shengyong
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2017/12/03
thermopower
bulky metallic wire
mean free path
size effect
high-temperature sensor
MEAN FREE-PATH
THERMOELECTRIC-POWER MEASUREMENTS
THIN-FILM THERMOCOUPLES
LIGHT-EMITTING DEVICES
TEMPERATURE-MEASUREMENT
ELECTRICAL-RESISTIVITY
ARTIFICIAL RETINA
COPPER-FILMS
SENSOR
MODEL
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