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浏览/检索结果: 共5条，第1-5条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262 作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip-scale package (CSP)  flip-chip die attach  high-power light-emitting diode (LED)  reliability  voids   A design and qualification of LED flip Chip-on-Board module with tunable color temperatures 期刊论文 MICROELECTRONICS RELIABILITY, 2018, 卷号: 84, 页码: 140-148 作者:  Fan, Jiajie;  Cao, Jianwu;  Yu, Chaohua;  Qian, Cheng;  Fan, Xuejun 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/30 LED  Wafer level chip scale package  Chip-on-Board  Tunable color temperatures  Luminous flux modeling   Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Wang, Zhen;  Fan, Jiajie;  Liu, Jie;  Hu, Aihua;  Qian, Cheng 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 LED  Chip scale package  Phosphor/silicone composites  Viscosity  Optimal cure process   A design and qualification of LED flip Chip-on-Board module with tunable color temperatures 会议论文 MICROELECTRONICS RELIABILITY, 2018-05-01 作者:  Fan, Jiajie;  Cao, Jianwu;  Yu, Chaohua;  Qian, Cheng;  Fan, Xuejun 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 LED  Wafer level chip scale package  Chip-on-Board  Tunable color temperatures  Luminous flux modeling   Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method 期刊论文 MATERIALS, 2017, 卷号: 10 作者:  Qian, Cheng;  Fan, Jiajie;  Fang, Jiayi;  Yu, Chaohua;  Ren, Yi 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30 light-emitting diode  chip scale package  accelerated aging  step stress test  reliability qualification