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CORC

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Periodic arrays of flux-closure domains in ferroelectric thin films with oxide electrodes 期刊论文
APPLIED PHYSICS LETTERS, 2017, 卷号: 111, 期号: 5
作者:  Li, S.;  Zhu, Y. L.;  Wang, Y. J.;  Tang, Y. L.;  Liu, Y.
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Emission characteristics of novel metal-insulator-metal emitter with porous Al2O3insulation layer 期刊论文
Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology, 2015, 卷号: 35, 期号: [db:dc_citation_issue], 页码: 1391-1396
作者:  Xue, Tao;  Zhang, Xiaoning;  Liu, Chunliang
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Formation Mechanism of Metal-Molecule-Metal Junctions: Molecule-Assisted Migration on Metal Defects 期刊论文
JOURNAL OF PHYSICAL CHEMISTRY C, 2015
Thompson, Damien; Liao, Jianhui; Nolan, Michael; Quinn, Aidan J.; Nijhuis, Christian A.; O' Nirmalraj, Peter N.; Schoenenberger, Christian; Calame, Michel; Dwyer, Colin
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文
Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4
作者:  Miao, J(苗静);  Shen, WJ(沈文江);  He, CD;  Xue, CY;  Xiong, JJ
收藏  |  浏览/下载：80/0  |  提交时间：2015/12/31
silicon  elemental semiconductors  silicon-on-insulator  wafer bonding  electromechanical effects  ultrasonic transducers  capacitive transducers  micromechanical devices  micromachining  vibrations  membranes  finite element analysis  reliability  capacitance  electromechanical coupling coefficient  capacitive micromachined ultrasonic transducer  impedance matching  propagation medium  microelectromechanical system capacitive ultrasonic transducer  silicon on insulator  wafer bonding  optimum geometric dimensions  membrane mechanical vibration  electrical characteristics  finite-element analysis  operation mode  device safety  device reliability  equivalent stress  operation-collapse voltage  bottom electrodes  glass substrate surface  parallel parasitic capacitance  Si  SiO2  
Integrating Reaction Chemistry into Molecular Electronic Devices 期刊论文
chemistry an asian journal, 2010
Shen, Qian; Guo, Xuefeng; Steigerwald, Michael L.; Nuckolls, Colin
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/10
酞菁铜（CuPc）薄膜器件的制备及其电双稳特性 期刊论文
真空科学与技术学报/Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology, 2008, 卷号: 28, 期号: 5, 页码: 394-398
作者:  李训栓;  彭应全;  宋长安;  杨青森;  赵明
收藏  |  浏览/下载：4/0  |  提交时间：2015/04/27
Study on the fabrication of orange micro-LED arrays for display (EI CONFERENCE) 会议论文
ICO20: Display Devices and Systems, August 21, 2005 - August 26, 2005, Changchun, China
Jin X.; Liang J.; Li J.; Zhao L.; Wang W.
收藏  |  浏览/下载：22/0  |  提交时间：2013/03/25
Arrays of micro-sized LEDs which can be used as microdisplays have been demonstrated in recent years. In order to reduce the input and output connections to the arrays  we employ a matrix addressable architecture  in which all the pixels in each row are connected by a common metal line on the top of the window layer (top electrode) or at the base of substrate(bottom electrode). Decreasing the size of electrodes makes for minimizing the size of device. The optic and electric isolation and good ohmic contact are also helpful to obtain superior optical and electrical performance. We describe a procedure of fabrication of AlGalnP-based orange micro-LED by wet etching. The structure of devices is etched using both isotropic and anisotropic etchant. The pixel size is about 16um 20um  and there are 1000 818 pixels in the light emitting chip whose diagonal is 1-in.  

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