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Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2016
Xu, Bingsheng; Chen, Junwei; Yuan, Zhangfu; Zang, Likun; Zhang, Lina; Wu, Yan
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrate 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016
Xu, Bingsheng; Wu, Yan; Zhang, Lina; Chen, Junwei; Yuan, Zhangfu
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04
Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：16/0  |  提交时间：2013/12/24
Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints 期刊论文
Journal of Applied Physics, 2012, 卷号: 112, 期号: 6
Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：17/0  |  提交时间：2013/02/05
Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K 期刊论文
colloids and surfaces a physicochemical and engineering aspects, 2012
Zang, Likun; Yuan, Zhangfu; Zhu, Yuanqing; Xu, Bingsheng; Matsuura, Hiroyuki; Tsukihashi, Fumitaka
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/12
In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：28/0  |  提交时间：2012/04/13
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K 期刊论文
应用表面科学, 2011
Zang, Likun; Yuan, Zhangfu; Xu, Hongyan; Xu, Bingsheng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/12
Microstructure of brazed joint and properties of two lead-free solder powders 期刊论文
Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2011, 卷号: 32, 期号: [db:dc_citation_issue], 页码: 28-33
作者:  Xu, Tian-Han;  Wang, Dang-Hui
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/10
Fabrication and properties of lead-free Sn-Ag-Cu-Ga solder alloy 期刊论文
2010, 2010
Chen Guohai; Ma Jusheng; Geng Zhiting
收藏  |  浏览/下载：7/0
R&D of lead-free solder in Tsinghua University 期刊论文
2010, 2010
Ma Ju-Sheng; Chen Guo-Hai
收藏  |  浏览/下载：1/0

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