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| Microstructure and growth mechanism of tin whiskers on RESn3 compounds 期刊论文 Acta Materialia, 2013, 卷号: 61, 期号: 2, 页码: 589-601 C. F. Li; Z. Q. Liu
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:20/0  |  提交时间:2013/12/24
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| Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:17/0  |  提交时间:2013/12/24
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| In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文 Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028 Q. K. Zhang; Z. F. Zhang
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:28/0  |  提交时间:2012/04/13
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| Tin Whisker Growth on NdSn(3) Powder 期刊论文 Journal of Electronic Materials, 2011, 卷号: 40, 期号: 9, 页码: 1962-1966 H. C. Shi; A. P. Xian
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:25/0  |  提交时间:2012/04/13
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| In situ investigation on the oxidation behavior of a RESn(3) film by transmission electron microscopy 期刊论文 Scripta Materialia, 2011, 卷号: 65, 期号: 12, 页码: 1049-1052 C. F. Li; Z. Q. Liu; P. J. Shang; J. K. Shang
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:10/0  |  提交时间:2012/04/13
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| Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K 期刊论文 应用表面科学, 2011 Zang, Likun; Yuan, Zhangfu; Xu, Hongyan; Xu, Bingsheng
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:5/0  |  提交时间:2015/11/12
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| 部分无铅焊料体系动力学研究 学位论文 2011, 2011 上官宁
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:4/0  |  提交时间:2016/02/14
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| Microstructure of brazed joint and properties of two lead-free solder powders 期刊论文 Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2011, 卷号: 32, 期号: [db:dc_citation_issue], 页码: 28-33 作者: Xu, Tian-Han; Wang, Dang-Hui
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:9/0  |  提交时间:2019/12/10
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| Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文 Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:16/0  |  提交时间:2012/04/13
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| Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376 Q. K. Zhang; Q. S. Zhu; H. F. Zou; Z. F. Zhang
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:13/0  |  提交时间:2012/04/13
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