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CORC

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A Universal Size Design Principle for Stretchable Inorganic Electronics to Work Consistently under Different Interface Conditions 期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2022, 页码: 9
作者:  Li, Shuang;  Lan, Yuqun;  Huang, YongAn;  Chen, Yuli;  Su, Yewang
收藏  |  浏览/下载：18/0  |  提交时间：2023/02/09
Role of interface on irradiation damage of Cu-diamond composites using classical molecular dynamics simulations 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 12, 页码: 16813-16824
作者:  Jin, Yanan;  Huang, Hai;  Zhong, Yinghui;  Yuan, Xiaoting;  Li, Huan
收藏  |  浏览/下载：30/0  |  提交时间：2022/08/22
Unveiling the pinning behavior of charged domain walls in BiFeO3 thin films via vacancy defects 会议论文
作者:  Geng, W.R.;  Tian, X.H.;  Jiang, Y.X.;  Zhu, Y.L.;  Tang, Y.L.
收藏  |  浏览/下载：4/0  |  提交时间：2020/12/18
Unveiling the pinning behavior of charged domain walls in BiFeO3 thin films via vacancy defects 期刊论文
Acta Materialia, 2020, 卷号: 186, 页码: 68-76
作者:  Geng, W.R.;  Tian, X.H.;  Jiang, Y.X.;  Zhu, Y.L.;  Tang, Y.L.
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
Structure Design and Performance of Hybridized Nanogenerators 期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2019, 卷号: 29, 期号: 41, 页码: 特刊: SI
作者:  Zhang, KW (Zhang, Kewei)[ 1,2 ];  Wang, YOH (Wang, Yuonhao)[ 3 ];  Yang, Y (Yang, Ya)[ 1,2 ]
收藏  |  浏览/下载：38/0  |  提交时间：2019/11/19
Questionnaire-Based Discussion of Finite Element Multiphysics Simulation Software in Power Electronics 期刊论文
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2018, 卷号: 33, 页码: 7010-7020
作者:  Song, Xueguan;  Pickert, Volker;  Ji, Bing;  Naayagi, R. T.;  Wang, Chen
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Detection of lower-limb movement intention from EEG signals 会议论文
Proceedings of the 2017 12th IEEE Conference on Industrial Electronics and Applications, ICIEA 2017
作者:  Liu, D.;  Chen, W.;  Pei, Z.;  Wang, J.
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30
The design and application of multi-sensor data fusion in open system architecture of avionics 会议论文
Proceedings of the 2017 12th IEEE Conference on Industrial Electronics and Applications, ICIEA 2017
作者:  Li, J.
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
Fabrication and Characterization of a Carbon Fiber Solder Composite Thermal Interface Material 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Hansson, Josef[1];  Ye, Lilei[2];  Liu, Johan[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24

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