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CORC

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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02
Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall 期刊论文
NANOMATERIALS, 2019, 卷号: 9, 期号: 3
作者:  Tang, Bin;  Miao, Jia;  Liu, Yingce;  Wan, Hui;  Li, Ning
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/05
48 48 pixelated addressable full-color micro display based on flip-chip micro LEDs 期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 31, 页码: 8383-8389
作者:  Y.Li;  J.Tao;  Y.Zhao;  J.Wang;  J.Lv
收藏  |  浏览/下载：3/0  |  提交时间：2020/08/24
Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall 期刊论文
Nanomaterials, 2019, 卷号: 9, 期号: 3, 页码: 8
作者:  B.Tang;  J.Miao;  Y.C.Liu;  H.Wan;  N.Li
收藏  |  浏览/下载：1/0  |  提交时间：2020/08/24
A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2018, 卷号: 140
作者:  Yao, X. J.[1];  Fang, J. J.[2];  Zhang, Wenjun[3]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/24
An Analytical Model for Permeability of Underfill Flow in Flip-Chip Packaging With Consideration of the Actual Specific Surface and Tortuosity 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1507-1514
作者:  Yao, Xing Jun[1];  Zhang, Wen Jun[2]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Effect of Dielectric Distributed Bragg Reflector on Electrical and Optical Properties of GaN-Based Flip-Chip Light-Emitting Diodes 期刊论文
MICROMACHINES, 2018, 卷号: 9, 期号: 12
作者:  Zhou, Shengjun;  Xu, Haohao;  Liu, Mengling;  Liu, Xingtong;  Zhao, Jie
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05
Low-Voltage, Flexible IGZO Transistors Gated by PSSNa Electrolyte 期刊论文
IEEE ELECTRON DEVICE LETTERS, 2018, 卷号: 39, 期号: 9, 页码: 1334-1337
作者:  Du, Lulu;  He, Dandan;  Liu, Yaxuan;  Xu, Mingsheng;  Wang, Qingpu
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11
Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262
作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Photoelectric Characteristics of Micro Flip-Chip AlGaInP Light Emitting Diode Array 期刊论文
Guangxue Xuebao/Acta Optica Sinica, 2018, 卷号: 38, 期号: 9
作者:  Ban, Zhang;  Liang, Jingqiu;  Lu, Jinguang;  Li, Yang
收藏  |  浏览/下载：2/0  |  提交时间：2019/09/17

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