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华南理工大学 [20]
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期刊论文 [42]
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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:
Huang, Ru
;
Ma, Haoran
;
Shang, Shengyan
;
Kunwar, Anil
;
Wang, Yunpeng
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2019/12/02
Chip scale packages
Copper
Copper alloys
Flip chip devices
Grain boundaries
Growth rate
Size determination
Soldered joints
Substrates
Tin alloys, Electronic product
Grain boundary motions
Interface reactions
Lateral growth rates
Longitudinal growth
Packaging process
Packaging technologies
Solder composition, Soldering
Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall
期刊论文
NANOMATERIALS, 2019, 卷号: 9, 期号: 3
作者:
Tang, Bin
;
Miao, Jia
;
Liu, Yingce
;
Wan, Hui
;
Li, Ning
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/05
flip-chip mini-LED
prism-structured sidewall
waveguide photons
light extraction
48 48 pixelated addressable full-color micro display based on flip-chip micro LEDs
期刊论文
Applied Optics, 2019, 卷号: 58, 期号: 31, 页码: 8383-8389
作者:
Y.Li
;
J.Tao
;
Y.Zhao
;
J.Wang
;
J.Lv
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/08/24
Light emitting diodes,Color,Etching,Flip chip devices,Pixels,Substrates
Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall
期刊论文
Nanomaterials, 2019, 卷号: 9, 期号: 3, 页码: 8
作者:
B.Tang
;
J.Miao
;
Y.C.Liu
;
H.Wan
;
N.Li
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/08/24
flip-chip mini-LED,prism-structured sidewall,waveguide photons,light,extraction,emitting-diodes,gan,efficiency,performance,improvement,surface,Science & Technology - Other Topics,Materials Science
A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging
期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2018, 卷号: 140
作者:
Yao, X. J.[1]
;
Fang, J. J.[2]
;
Zhang, Wenjun[3]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/24
flip-chip packaging
underfill
superficial cross-sectional area
pore average cross-sectional area
superficial permeability
pore permeability
An Analytical Model for Permeability of Underfill Flow in Flip-Chip Packaging With Consideration of the Actual Specific Surface and Tortuosity
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1507-1514
作者:
Yao, Xing Jun[1]
;
Zhang, Wen Jun[2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/22
Differential element method (DEM)
flip-chip packaging
permeability
porous medium
specific surface
tortuosity
underfill
Effect of Dielectric Distributed Bragg Reflector on Electrical and Optical Properties of GaN-Based Flip-Chip Light-Emitting Diodes
期刊论文
MICROMACHINES, 2018, 卷号: 9, 期号: 12
作者:
Zhou, Shengjun
;
Xu, Haohao
;
Liu, Mengling
;
Liu, Xingtong
;
Zhao, Jie
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/05
flip-chip light-emitting diodes
distributed Bragg reflector
light output power
external quantum efficiency
Low-Voltage, Flexible IGZO Transistors Gated by PSSNa Electrolyte
期刊论文
IEEE ELECTRON DEVICE LETTERS, 2018, 卷号: 39, 期号: 9, 页码: 1334-1337
作者:
Du, Lulu
;
He, Dandan
;
Liu, Yaxuan
;
Xu, Mingsheng
;
Wang, Qingpu
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/11
Electric double layer transistors (EDLTs)
carving
cutting
and
flip-chip bonding (CCFB)
flexible
low operating voltages
Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262
作者:
Jiang, Chengshuo
;
Fan, Jiajie
;
Qian, Cheng
;
Zhang, Hao
;
Fan, Xuejun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
Chip-scale package (CSP)
flip-chip die attach
high-power light-emitting diode (LED)
reliability
voids
Photoelectric Characteristics of Micro Flip-Chip AlGaInP Light Emitting Diode Array
期刊论文
Guangxue Xuebao/Acta Optica Sinica, 2018, 卷号: 38, 期号: 9
作者:
Ban, Zhang
;
Liang, Jingqiu
;
Lu, Jinguang
;
Li, Yang
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/09/17
Flip chip devices
Aluminum alloys
Copper
Diodes
Energy utilization
Gallium alloys
Heat convection
Heat resistance
III-V semiconductors
Indium alloys
Light emitting diodes
Microchannels
Numerical methods
Optical devices
Photoelectricity
Polydimethylsiloxane
Semiconductor alloys
Silicones
Temperature
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