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浏览/检索结果: 共4条，第1-4条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序作者升序作者降序提交时间升序提交时间降序题名升序题名降序 Rh(III)-Catalyzed direct C-7 amination of indolines with anthranils 期刊论文 ORGANIC CHEMISTRY FRONTIERS, 2017, 卷号: 4, 期号: 2, 页码: 250-254 作者:  Li, Haoyi[1];  Jie, Jiyang[2];  Wu, Songxiao[3];  Yang, Xiaobo[4];  Xu, Hao[5] 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/23 A highly conductive thermoplastic electrically conductive adhesive for flexible and low cost electronics (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Wu, Haoyi[1];  Yang, Cheng[1];  Liu, Jingping[1];  Cui, Xiaoya[1];  Xie, Binghe[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 printed electronics  flexible electronics  conductive adhesive   Scalable Synthesis of the Mono-dispersed Silver Micro-dendrites and Their Applications in the Ultralow Cost Printed Electrically Conductive A (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Cui, Xiaoya[1];  Yang, Cheng[1];  Zhang, Zhexu[1];  Wu, Haoyi[1];  Chiang, Sumwai[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 silver dendrites  3-D fractal structure  electrically conductive adhesives  percolation threshold  low-temperature sintering   Improvement of the Thermal Conductivity by Surface Iodination (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Wu, Haoyi[1];  Yang, Cheng[1];  Chiang, Sumwai[1];  Kang, Feiyu[1];  Kong, Lingwen[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 thermal conductive adhesive  thermal conductivity  surface iodination