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CORC

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Mechanical properties and failure behavior of hexagonal boron nitride sheets with nano-cracks 期刊论文
ELSEVIER SCIENCE BV, 2017, 卷号: 140, 页码: 356-366
作者:  Li, Nan;  Ding, Ning;  Qu, Shen;  Liu, Long;  Guo, Weimin
收藏  |  浏览/下载：41/0  |  提交时间：2018/01/10
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys 期刊论文
Annual Meeting of the Minerals-Metals-and-Materials-Society, 2006, 卷号: 35, 页码: 89-93
作者:  Law, CMT;  Wu, CML;  Yu, DQ;  Wang, L;  Lai, JKL
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/27
Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2005, 卷号: 20, 页码: 2205-2212
作者:  Yu, DQ;  Wu, CML;  He, DP;  Zhao, N;  Wang, L
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02
Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 卷号: 392, 页码: 192-199
作者:  Yu, DQ;  Wu, CML;  Law, CMT;  Wang, L;  Lai, JKL
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02
The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 卷号: 389, 页码: 153-158
作者:  Yu, DQ;  Wang, L;  Wu, CML;  Law, CMT
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02
Microstructural evolution of lead-free Sn-Bi-Ag-CuSMT joints during aging 期刊论文
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 卷号: 28, 页码: 128-133
作者:  Wu, CML;  Huang, MLL
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/02
Creep resistance of tin-based lead-free solder alloys 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2005, 卷号: 34, 页码: 1373-1377
作者:  Huang, ML;  Wu, CML;  Wang, L
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02
Properties of lead-free solder alloys with rare earth element additions 期刊论文
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2004, 卷号: 44, 页码: 1-44
作者:  Wu, CML;  Yu, DQ;  Law, CMT;  Wang, L
收藏  |  浏览/下载：6/0  |  提交时间：2020/01/02
The wettability and microstructure of Sn-Zn-RE alloys 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2003, 卷号: 32, 页码: 63-69
作者:  Wu, CML;  Law, CMT;  Yu, DQ;  Wang, L
收藏  |  浏览/下载：5/0  |  提交时间：2020/01/02
Morphological study of sisal fibres 期刊论文
advanced composites letters, 2002
Bai, SL; Li, RKY; Mai, YW; Wu, CML
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13

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