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95-GHz Front-End Receiving Multichip Module on Multilayer LCP Substrate for Passive Millimeter-Wave Imaging 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 12, 页码: 2180-2189
作者:  Zhang, Yifei;  Martin, Richard D.;  Shi, Shouyuan;  Wright, Andrew A.;  Yao, Peng
收藏  |  浏览/下载:15/0  |  提交时间:2019/12/11
Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at W-Band 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 期号: 10, 页码: 1655-1662
作者:  Zhang, Yifei;  Shi, Shouyuan;  Martin, Richard D.;  Wright, Andrew A.;  Yao, Peng
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/11
Ultra-Wideband Vialess Microstrip Line-to-Stripline Transition in Multilayer LCP Substrate for E- and W-Band Applications 期刊论文
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2017, 卷号: 27, 期号: 12, 页码: 1101-1103
作者:  Zhang, Yifei;  Shi, Shouyuan;  Martin, Richard D.;  Yao, Peng;  Wang, Fuquan
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/11
Ultra-Wideband Microstrip Line-to-Microstrip Line Transition in Multilayer LCP Substrate at Millimeter-Wave Frequencies 期刊论文
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2017, 卷号: 27, 期号: 10, 页码: 873-875
作者:  Zhang, Yifei;  Wang, Fuquan;  Shi, Shouyuan;  Martin, Richard D.;  Yao, Peng
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/11
湖北省小麦条锈菌越夏的初步研究 期刊论文
植物病理学报, 1987, 期号: 01, 页码: 7
作者:  谢水仙
收藏  |  浏览/下载:1/0  |  提交时间:2017/10/23


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