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浏览/检索结果: 共2条，第1-2条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment 会议论文 Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018 作者:  Xu, Hongyan;  Li, Jianqiang;  Ning, Puqi;  Xu, Ju 收藏  |  浏览/下载：20/0  |  提交时间：2019/06/21 microstructure evolution  PHASE  as-reflowed  SOLDER  aging test  SILVER  temperature cycling  shearing strength   Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment 期刊论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1709, 1715 作者:  Xu, HY;  Li, JQ;  Ning, PQ;  Xu, J;  Xu, Hongyan 收藏  |  浏览/下载：21/0  |  提交时间：2018/12/29 microstructure evolution  PHASE  as-reflowed  SOLDER  aging test  SILVER  temperature cycling  shearing strength