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浏览/检索结果: 共8条，第1-8条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序作者升序作者降序提交时间升序提交时间降序题名升序题名降序 Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys 期刊论文 Annual Meeting of the Minerals-Metals-and-Materials-Society, 2006, 卷号: 35, 页码: 89-93 作者:  Law, CMT;  Wu, CML;  Yu, DQ;  Wang, L;  Lai, JKL 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/27 lead-free solder  rare earth (RE) elements  solderability test  intermetallic layer   Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 卷号: 392, 页码: 192-199 作者:  Yu, DQ;  Wu, CML;  Law, CMT;  Wang, L;  Lai, JKL 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02 Sn-3.5Ag lead-free solder  nano-size particles  IMC thickness  dissolution rate  activity energy   The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 卷号: 389, 页码: 153-158 作者:  Yu, DQ;  Wang, L;  Wu, CML;  Law, CMT 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02 lead free solder  intermetallic compounds  Ag3Sn  wetting reaction   Properties of lead-free solder alloys with rare earth element additions 期刊论文 MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2004, 卷号: 44, 页码: 1-44 作者:  Wu, CML;  Yu, DQ;  Law, CMT;  Wang, L 收藏  |  浏览/下载：6/0  |  提交时间：2020/01/02 lead-free solder alloy  rare earth elements  tensile strength  hardness  creep  Wettability  Sn-Ag  Sn-Cu  Sn-Zn  Sn-Ag-Cu  reliability  interfacial reaction  BGA   The wettability and microstructure of Sn-Zn-RE alloys 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2003, 卷号: 32, 页码: 63-69 作者:  Wu, CML;  Law, CMT;  Yu, DQ;  Wang, L 收藏  |  浏览/下载：5/0  |  提交时间：2020/01/02 lead-free solder  Sn-9Zn  rare earth  wetting force  wetting time  contact angle  microhardness   Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn-Ag alloy by doping with rare-earth elements 期刊论文 JOURNAL OF MATERIALS RESEARCH, 2002, 卷号: 17, 页码: 3146-3154 作者:  Wu, CML;  Yu, DQ;  Law, CMT;  Wang, L 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/02 The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2002, 卷号: 31, 页码: 921-927 作者:  Wu, CML;  Yu, DQ;  Law, CMT;  Wang, L 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/02 Sn-9Zn lead-free solder  Ce and La rare earth elements  tensile strength  0.2% proof stress  elongation  solderability  rosin-based active flux   Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2002, 卷号: 31, 页码: 928-932 作者:  Wu, CML;  Yu, DQ;  Law, CMT;  Wang, L 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/02 tin-copper lead-free alloy  Ce and La rare earth elements  aging  creep  tensile strength