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浏览/检索结果: 共11条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds 期刊论文 ADVANCED MATERIALS INTERFACES, 2018, 卷号: 5 作者:  Sun, Shuangxi[1];  Samani, Majid Kabiri[2];  Fu, Yifeng[3];  Xu, Tao[4];  Ye, Lilei[5] 收藏  |  浏览/下载：27/0  |  提交时间：2019/04/22 carbon nanotubes  graphene  heat dissipation  hybrid materials   Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors 期刊论文 SMALL, 2016, 卷号: 12, 页码: 1521-1526 作者:  Jiang, Di[1];  Wang, Nan[2];  Edwards, Michael[3];  Mu, Wei[4];  Nylander, Andreas[5] 收藏  |  浏览/下载：25/0  |  提交时间：2019/04/26 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging 期刊论文 JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 卷号: 49 作者:  Bao, Jie[1];  Edwards, Michael[2];  Huang, Shirong[3];  Zhang, Yong[4];  Fu, Yifeng[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26 boron nitride  thermal conduction  lateral heat spreader  electrical insulation   Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications 期刊论文 CARBON, 2016, 卷号: 106, 页码: 195-201 作者:  Zhang, Yong[1];  Edwards, Michael[2];  Samani, Majid Kabiri[3];  Logothetis, Nikolaos[4];  Ye, Lilei[5] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/26 Enhanced cold wall CVD reactor growth of horizontally aligned single-walled carbon nanotubes 期刊论文 ELECTRONIC MATERIALS LETTERS, 2016, 卷号: 12, 页码: 329-337 作者:  Mu, Wei[1];  Kwak, Eun-Hye[2];  Chen, Bingan[3];  Huang, Shirong[4];  Edwards, Michael[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26 horizontally aligned  SWCNTs  cold-wall  hot-wall  CVD  synthesis   Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects 期刊论文 NANOTECHNOLOGY, 2016, 卷号: 27, 页码: 335705 作者:  Sun, Shuangxi[1];  Mu, Wei[2];  Edwards, Michael[3];  Mencarelli, Davide[4];  Pierantoni, Luca[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26 TSV  CNT-Cu  nanocomposite  3D-IC   Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging 会议论文 6th Electronic System-Integration Technology Conference (ESTC), 2016-09-13 作者:  Huang, Shirong[1];  Wang, Ning[2];  Bao, Jie[3];  Ye, Hui[4];  Zhang, Dongsheng[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26 vertically aligned multiwall carbon nanotubes  electronic packaging  infrared emissivity characterization  homogeneous sparseness   The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Huang, Shirong[1];  Bao, Jie[2];  Ye, Hui[3];  Wang, Ning[4];  Yuan, Guangjie[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/26 Graphene-based film  Thermal performance  Finite element analysis  Electronic packaging   Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2015, 卷号: 44, 页码: 2898-2907 作者:  Mu, Wei[1];  Sun, Shuangxi[2];  Jiang, Di[3];  Fu, Yifeng[4];  Edwards, Michael[5] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/26 Carbon nanotube bundles  postgrowth transfer  TSV  polymer filling  resistivity