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浏览/检索结果: 共6条，第1-6条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序作者升序作者降序提交时间升序提交时间降序题名升序题名降序 Controlling the morphology of ZnO structures via low temperature hydrothermal method and their optoelectronic application 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 89, 页码: 154-160 作者:  Liang, Qichao[1];  Qiao, Fen[2];  Cui, Xuejun[3];  Hou, Xiaoya[4] 收藏  |  浏览/下载：20/0  |  提交时间：2019/12/24 ZnO  Zn(OH)(2)  Substrate  Hydrothermal method  Optoelectronic performance   Scalable Synthesis and Application of Mono-dispersed Hierarchical Silver Micro-particles (CPCI-S收录) 会议 作者:  Yang, Rui[1];  Yang, Cheng[1];  Deng, Yubin[1];  Luo, Yingying[1];  Wu, Dang[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 silver micro-particles  hierarchical structures  low-temperature sintering  electronic devices   Silver Dendrite-based Nanocomposites for Current Cutting-off Fuse (CPCI-S收录) 会议 作者:  Yang, Rui[1];  Yang, Cheng[1];  Cui, Xiaoya[1];  Zhang, Zhexu[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 current cutting-off fuse  silver dendrite  low fusing current  MEMS devices   A Novel Nickel Nanocone Array Current Collector for High Performance supercapacitor (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Xie, Binghe[1];  Yang, Cheng[1];  Su, Zijin[1];  Zhang, Zhexu[1];  Cui, Xiaoya[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/12 supercapacitor  nickel nanocone array  electrochemical perpformance   A highly conductive thermoplastic electrically conductive adhesive for flexible and low cost electronics (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Wu, Haoyi[1];  Yang, Cheng[1];  Liu, Jingping[1];  Cui, Xiaoya[1];  Xie, Binghe[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 printed electronics  flexible electronics  conductive adhesive   Scalable Synthesis of the Mono-dispersed Silver Micro-dendrites and Their Applications in the Ultralow Cost Printed Electrically Conductive A (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Cui, Xiaoya[1];  Yang, Cheng[1];  Zhang, Zhexu[1];  Wu, Haoyi[1];  Chiang, Sumwai[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 silver dendrites  3-D fractal structure  electrically conductive adhesives  percolation threshold  low-temperature sintering