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CORC

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Neoadjuvant Savolitinib targeted therapy stage IIIA-N2 primary lung adenocarcinoma harboring MET Exon 14 skipping mutation: A case report 期刊论文
FRONTIERS IN ONCOLOGY, 2022, 卷号: 12
作者:  Fu, Meng;  Feng, Chun-Mei;  Xia, Da-Qing;  Ji, Zi-Mei;  Xia, Huai-Ling
收藏  |  浏览/下载：18/0  |  提交时间：2022/12/23
Early Cretaceous potassic volcanic rocks from the northern margin of the Sulu orogenic belt, Shandong Province, eastern China: Constraints on petrogenesis and crust-mantle interaction 期刊论文
GEOLOGICAL JOURNAL, 2020, 卷号: 55, 期号: 1, 页码: 912-933
作者:  Cao, Guang-Yue;  Xue, Huai-Min;  Liu, Zhe
收藏  |  浏览/下载：14/0  |  提交时间：2020/04/27
U-Pb zircon, geochemical, and Sr-Nd-Hf isotopic data for late Mesozoic volcanic rocks along the Tan-Lu fault zone of Shandong Province, eastern China: constraints on magma genesis and lithospheric thinning 期刊论文
INTERNATIONAL GEOLOGY REVIEW, 2019, 卷号: 61, 期号: 8, 页码: 972-996
作者:  Cao, Guang-Yue;  Xue, Huai-Min;  Liu, Zhe;  Lu, Zeng-Long
收藏  |  浏览/下载：5/0  |  提交时间：2020/04/27
A New Prewetting Process of Through Silicon Vias (TSV) Electroplating for 3D Integration 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2019, 卷号: 28, 期号: 3
作者:  Li, Cao;  Nie, Jun;  Zou, Jinglong;  Liu, Sheng;  Zheng, Huai
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/05
Large-scale and contact-free fabrication of microwell arrays based on electro-pressure of depositing ions 期刊论文
AIP ADVANCES, 2019, 卷号: 9, 期号: 4
作者:  Li, Cao;  Zou, Jinglong;  Wu, Jiading;  Zhu, Tingting;  Fei, Peng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/05
A new prewetting process of through silicon vias (TSV) electroplating for 3D integration 期刊论文
Journal of Microelectromechanical Systems, 2019, 卷号: 28, 期号: 3
作者:  Li, Cao;  Nie, Jun;  Zou, Jinglong;  Liu, Sheng;  Zheng, Huai
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/05
Large-scale and contact-free fabrication of microwell arrays based on electro-pressure of depositing ions 期刊论文
AIP Advances, 2019, 卷号: 9, 期号: 4
作者:  Li, Cao;  Zou, Jinglong;  Wu, Jiading;  Zhu, Tingting;  Fei, Peng
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/05
Study of Annular Copper-Filled TSVs of Sensor and Interposer Chips for 3-D Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 卷号: 9, 期号: 3
作者:  Li, Cao;  Zou, Jinglong;  Liu, Sheng;  Zheng, Huai;  Fei, Peng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/05

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