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Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文
ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Wu, Yingchao
收藏  |  浏览/下载:30/0  |  提交时间:2019/12/02
Effects of Cu Nanoparticles Doped Flux on the Microstructure of IMCs between Sn Solder and Cu Substrate 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Shang, Shengyan;  Kunwar, Anil;  Wu, Yingchao;  Ma, Haitao
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/03
论环境侵权诉讼中因果关系的证明规则 学位论文
2017
作者:  尚营超
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/05
用于质子交换膜燃料电池催化剂结构研究的原位XAFS实验方法 期刊论文
物理化学学报, 2015, 期号: 8, 页码: 1609-1614
作者:  尚明丰;  段佩权;  赵天天;  唐文超;  林瑞
收藏  |  浏览/下载:41/0  |  提交时间:2015/12/09
Multidrug-resistant clones of community-associated meticillin-resistant Staphylococcus aureus isolated from Chinese children and the resistance genes to clindamycin and mupirocin 期刊论文
JOURNAL OF MEDICAL MICROBIOLOGY, 2012, 卷号: 61, 期号: 9
作者:  Wang, Lijuan;  Liu, Yingchao;  Yang, Yonghong;  Huang, Guoying;  Wang, Chuanqing
收藏  |  浏览/下载:13/0  |  提交时间:2019/12/19
Susceptibility to and resistance determinants of fusidic acid in Staphylococcus aureus isolated from Chinese children with skin and soft tissue infections 期刊论文
FEMS IMMUNOLOGY AND MEDICAL MICROBIOLOGY, 2012, 卷号: 64, 期号: 2
作者:  Liu, Yingchao;  Geng, Wenjing;  Yang, Yonghong;  Wang, Chuanqing;  Zheng, Yaojie
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/19


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