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Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints
期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:
Gao, Li-Yin
;
Luo, Yi-Xiu
;
Wan, Peng
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:266/0
  |  
提交时间:2021/10/15
Solder joint
Intermetallic compound
Mechanical property
Nano-indentation
First principle calculation
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin
;
Liu, Zhi-Quan
;
Li, Cai-Fu
收藏
  |  
浏览/下载:34/0
  |  
提交时间:2017/08/17
Fe-Ni under bump metallization (UBM)
thermal cycling
microstructural evolution
lifetime
recrystallization
electron backscatter diffraction (EBSD)
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint
期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
H. F. Zhou
;
J. D. Guo
;
Q. S. Zhu
;
J. K. Shang
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  |  
浏览/下载:21/0
  |  
提交时间:2013/12/24
Under-bump metallization (UBM)
Electroless Fe-42Ni(P)
Sn
Solderability
Interfacial reaction
fe-p
solderability
deposition
alloys
sn
behavior
systems
surface
cu
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints
期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 11, 页码: 2398-2404
X. N. Du
;
J. D. Guo
;
J. K. Shang
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  |  
浏览/下载:18/0
  |  
提交时间:2012/04/13
Electromigration
solder joint
intermetallic compound
lead-free solders
alloy
interconnects
technology
bump
Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint
期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
H. F. Zou
;
Q. S. Zhu
;
Z. F. Zhang
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  |  
浏览/下载:16/0
  |  
提交时间:2012/04/13
Ag single crystal substrate
Sn-3.8Ag-0.7Cu solder
intermetallic
compounds (IMCs)
growth kinetics
tensile strength
fracture
lead-free solder
interfacial reaction
cu-substrate
microstructure
metallization
sn-3.5ag
bump
ni
strength
pb
Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 卷号: 417, 期号: 1-2, 页码: 143-149
Xia, YH
;
Xie, XM
;
Lu, CY
;
Chang, JL
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浏览/下载:15/0
  |  
提交时间:2012/03/24
WT-PERCENT CU
LEAD-FREE SOLDERS
INTERFACIAL REACTIONS
SN-3.5-PERCENT-AG SOLDER
BUMP METALLIZATION
SN
NI
ALLOYS
REFLOW
MICROSTRUCTURE
Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录)
会议
作者:
Jiang, Han[1]
;
Liang, Shui-Bao[1]
;
Yuwen, Hui-Hui[1]
;
Zhang, Xin-Ping[1]
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  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
TSV
solder bump joint
thermal fatigue
size effect
finite element analysis
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