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Temperature gradient enhances the solidification process and properties of a CoCrFeNi high-entropy alloy: Atomic insights from molecular dynamics simulations
期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2024, 卷号: 231, 页码: 12
作者:
Xie, Lu
;
Wu, Guangda
;
Liaw, Peter K.
;
Wang, Wenrui
;
Li, Dongyue
收藏
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浏览/下载:10/0
  |  
提交时间:2023/12/11
High-entropy alloy
Temperature gradient
Stress distribution
Cooling rate
Buffer electrode layers tuned electrical properties, fatigue behavior and phase transition of KNN-based lead-free ferroelectric films
期刊论文
JOURNAL OF MATERIALS CHEMISTRY C, 2023, 卷号: 11
作者:
Xu, Liqiang
;
Zhu, Beibei
;
Dai, Song
;
Han, Kun
;
Chen, Pingfan
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  |  
浏览/下载:7/0
  |  
提交时间:2023/11/17
Ammonium Salt Assisted Crystallization for High Performance Two-Dimensional Lead-Free Perovskite Photodetector
期刊论文
ACS Applied Electronic Materials, 2023, 卷号: 5, 期号: 4, 页码: 2169-2177
作者:
T. Huang
;
R. Li
;
X. Chen
;
Y. Li
;
Y. Chang
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浏览/下载:0/0
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提交时间:2024/07/03
Modulating mechanical performances of metallic amorphous materials through phase gradient
期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2022, 卷号: 234, 页码: 107680
作者:
Guan, Yunlong
;
Wang YJ(王云江)
;
Song, Weidong
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  |  
浏览/下载:28/0
  |  
提交时间:2022/10/23
Metallic glasses
Strength-ductility synergy
Phase gradient
Shear bands
Molecular dynamics
Dopant-free hole conductor with hybrid multisite passivation for perovskite solar cells
期刊论文
MATERIALS LETTERS, 2022, 卷号: 326
作者:
Zhao, Chundie
;
Kong, Fantai
;
Chen, Shuanghong
;
Peng, Yaole
;
Zhang, Jinxue
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  |  
浏览/下载:18/0
  |  
提交时间:2022/12/22
Hole transporting material
Hybrid multisite passivation
Solar energy materials
Organic
Perovskite solar cell
Improved Solubility in Metavalently Bonded Solid Leads to Band Alignment, Ultralow Thermal Conductivity, and High Thermoelectric Performance in SnTe
期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2022
作者:
Liu, Yuqi
;
Zhang, Xuemei
;
Nan, Pengfei
;
Zou, Bo
;
Zhang, Qingtang
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  |  
浏览/下载:27/0
  |  
提交时间:2022/12/22
band alignments
materials designs
metavalent bonding
solubility limits
thermoelectric
Enhanced photoluminescence stability and internal defect evolution of the all-inorganic lead-free CsEuCl3 perovskite nanocrystals
期刊论文
PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2022, 卷号: 24
作者:
Gao, Yalei
;
Zhang, Tao
;
Liu, Jun
;
Liu, Hongjun
;
Li, Meixian
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浏览/下载:17/0
  |  
提交时间:2022/12/23
In-situ electronic structure redistribution tuning of single-atom Mn/g-C3N4 catalyst to trap atomic-scale lead(II) for highly stable and accurate electroanalysis
期刊论文
JOURNAL OF HAZARDOUS MATERIALS, 2022, 卷号: 435
作者:
Li, Yong-Yu
;
Song, Zong-Yin
;
Xiao, Xiang-Yu
;
Zhang, Long-Ke
;
Huang, Hong-Qi
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  |  
浏览/下载:18/0
  |  
提交时间:2022/12/23
Mn single atom
Electronic structure redistribution
Valance cycles
Atomic-scale Pb(II)
Electroanalysis
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
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  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Research on Bi contents addition into Sn-Cu-based lead-free solder alloy
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603
作者:
Huang, Hai
;
Chen, Bin
;
Hu, Xiaowu
;
Jiang, Xiongxin
;
Li, Qinglin
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  |  
浏览/下载:88/0
  |  
提交时间:2022/07/19
Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness
Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
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